Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition

• US 4,604,303 A
• Filed: 05/04/1984
• Issued: 08/05/1986
• Est. Priority Date: 05/11/1983
• Status: Expired due to Term

• Current Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Original Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Inventors: Kondo, Susumu, Nogami, Tatsuya, Takakura, Makoto
• Primary Examiner(s): Schofer, Joseph L.
• Assistant Examiner(s): SAROFIM, NABIL F
• Application Number:
  US06/607,214
• Time in Patent Office: 823 Days
• Field of Search: 427/229, 428/457
• US Class Current: 427/229
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 5/0091 Complexes with metal-heteroatom-bonds
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/121 Metallo-organic compounds
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A polymer composition comprising a polymer and an organic metal complex uniformly dispersed or dissolved therein.

Claims

1. A method for producing a metallized polymer, which comprises:

(a) contacting a polymer film comprising a polymer and an organic metal complex wherein the weight ratio of the polymer to the metal of said organic metal complex ranges from about 99.9;

0.1 to 80;

20, with a metallizing board, wherein said metallizing board has a heat-treated coating thereon comprising said organic metal complex;

(b) forming a metal layer on the surface of said film from the liberated metal from said organic metal complex by heating the polymer film and coated metallizing board of step (a); and

(c) recovering a polymer film with a metallized surface thereon.

2. A polymer film with a metallized surface, prepared by the method according to Claim 1.

3. A polymer film having a metal layer of a predetermined pattern on its surface, prepared by the method according to Claim 1.

4. A polymer with fine metal particles uniformly dispersed therein, prepared by the method according to Claim 1.

5. The polymer according to Claim 4, which is a highly dielectric polymer.

6. A pressure-sensitively conductive rubber-like polymer film with a metallized surface, prepared by the method according to Claim 1.

7. The method of claim 1 wherein the weight ratio of the polymer to the metal of the organic metal complex is within a range of from 99.99:

0.01 to 1;

99.

8. The method of claim 1 wherein the central metal of the organic metal complex is at least one metal selected from the group consisting of metals of Groups IV-A, V-A, VII-A, VIII and I-B of the Periodic Law Table.

9. The method of claim 1 wherein the central metal is at least one metal selected from the group consisting of titanium, zirconium, vanadium, chromium, molybdenum. tungsten, manganese, iron, cobalt, nickel, ruthenium;

rhodium, iridium, palladium, osmium, platinum copper, silver and gold.

10. The method of claim 1 wherein the ligand of the organic metal complex is at least one ligand selected from the group consisting of a tertiary phosphine, a tertiary phosphite, carbon monoxide, an aliphatic or alicyclic olefin, a conjugated olefin, an aryl compound, a heterocyclic compound, an organic cyano compound, an organic isonitrile compound, an organic mercapto compound, a compound having an alkyl group, a vinyl group, an allyl group, an ethynyl group or an acyl group, halogen, oxygen, hydrogen and nitrogen.

11. The method of claim 1 wherein the ligand of the organic metal complex is at least one ligand selected from the group consisting of triphenylphosphine, tributylphosphine, triethylphosphine, triphenylphosphite, tributylphosphite, triethylphosphite, carbon monoxide, cyclooctadiene, a substituted or unsubstituted cyclopentadiene, cyclooctatetraene, butadiene, pentadiene, a substituted or unsubstituted benzene, acetonitrile, benzonitrile, a compound having a lower alkyl group or a benzyl group, ethylene, propylene, isobutylene, t-butyl-isonitrile, vinyl-isonitrile, benzo-isonitrile, a substituted or unsubstituted acetylene, acetylacetone, ethyl acetyl acetonate, pyridine, thiophene, quinoline, furan, 2,2'"'"'-dipyridyl, ethylenedithiol, toluene-3,4-dithiol, chlorine and bromine.

12. The method of claim 1 wherein the polymer is at least one polymer selected from the group consisting of an ionomer resin, an acrylonitrile-acrylic-styrene resin, an acrylonitrile-styrene resin, an acrylonitrile-butadiene-styrene resin, a methylmethacrylate-butadiene-styrene resin, a phenoxy resin, an ethylene-vinylchloride copolymer, an ethylene-vinylacetate copolymer, a polystyrene, a polyvinylidene chloride, a vinyl acetate, a polyethylene, a polypropylene, a polybutadiene, a polyvinylidene fluoride, a polytetrafluoroethylene, a polyacetal, a polyamide, a polyamide-imide, a polyarylate, a polyether-imide, a polyether-ether ketone, a polyethyleneterephthalate, a polybutyleneterephthalate, a polycarbonate, a polysulphone, a polyethersulphone, a polyphenylene oxide, a polyphenylene sulfide, a polymethylmethacrylate, a guanamine resin, a diallylphthalate resin, a vinyl ester resin, a phenol resin, an unsaturated polyester resin, a furan resin, a polyimide resin, a poly-p-hydroxybenzoate, a urethane resin, a melamineformaldehyde resin, a urea-formaldehyde resin, an epoxy resin and a xylene-formaldehyde resin.

13. The method of claim 1 wherin the polymer is at least one rubber-like polymer selected from the group consisting of a styrene-butadiene rubber, a polybutadiene rubber, a polyisoprene rubber, an acrylo nitrile-butadiene rubber, a polychloroprene rubber, a butyl rubber, a urethane rubber, an acrylate rubber, a silicone rubber, a fluorinated rubber, a styrene-block copolymer, a thermoplastic elastomer polyolefin, a thermoplastic elastomer polyvinylchloride, a thermoplastic elastomer polyurethane, a thermoplastic elastomer polyester, a thermoplastic elastomer polyamide, a thermoplastic elastomer fluorinated resin and a natural rubber.

14. The method of claim 1, wherein said metallizing board is aluminum or glass.

15. The method of claim 1, wherein said metallizing board is a resin plate having a heat treated coating thereon comprising an organic metal complex.

16. The method of claim 1, wherein said metallizing board is partially coated with a resin not capable of inducing metallization.

17. The method of claim 16, wherein the surface of the recovered metallized polymer contains a pattern.