Method and apparatus for microwave plasma anisotropic dry etching

• US 4,609,428 A
• Filed: 07/18/1985
• Issued: 09/02/1986
• Est. Priority Date: 07/23/1984
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Fujimura, Shuzo
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/756,233
• Time in Patent Office: 411 Days
• Field of Search: 156/345, 156/643, 156/646, 204/192 E, 204/298, 427/38, 427/39, 118/728, 118/50.1, 118/620, 134/1
• US Class Current: 438/728
• CPC Class Codes: H01J 37/3053 for evaporating or etching
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01J 37/3266 Magnetic control means
• CPC Class Codes: H01J 37/32678 Electron cyclotron resonance

Abstract

A microwave plasma etching method and apparatus for performing substantially anisotropic etching to form micropatterns on IC substrates. A microwave power source creates a plasma from a gas with a relatively low pressure such as 10^-3 to 10^-4 Torr, so that the mean free path of the gas molecules exceeds the dimensions of the etching apparatus. A magnetic field is generated in a plasma generating chamber, a reaction chamber where in the substrate is mounted and a connecting chamber. The plasma discharge is enhanced by a cyclotron resonance magnetic field intensity corresponding to the frequency of the microwave power applied to the plasma chamber. The magnetic field creates a magnetic mirror which prevents the electrons in the plasma from entering into the reaction chamber so as to eliminate the generation of free radicals in which the reaction chamber which adversely affect the anisotropic etching ability.

Claims

1. A microwave plasma etching apparatus comprising:

a vacuum vessel, filled with a gas having a predetermined pressure, including

a plasma generating chamber,

a reaction chamber,

a connecting chamber for connecting said plasma generating chamber and said reaction chamber, the connecting chamber having an axis, and

means, positioned in the reaction chamber, for holding a workpiece at a position in line with the axis of the connecting chamber and electrically isolating the workpiece;

means for applying microwave power of a predetermined frequency to the plama generating chamber for generating therein a plasma, the plasma including ions, electrons and free radicals; and

means for generating a magnetic field having a cyclotron resonance point in the plasma generating chamber for causing a cyclotron resonance of electrons in the plasma corresonding to the predetermined frequency of the microwave power, and having a peak point between said cyclotron resonance point and said workpiece at which said magnetic field intensity has a maximum value and functions as a magnetic mirror for reflecting the electrons in the plasma while allowing the free radicals and ions to pass the magnetic mirror along the axis of the connecting chamber to impinge on the workpiece, thereby to perform substantially anisotropic plasma etching of the workpiece.

2. A microwave plasma etching apparatus according to claim 1, wherein the frequency of the microwave power is approximately 2.45 GHz, the magnetic field intensity of the cyclotron resonance point approximately 875 Gauss, and the magnetic field intensity of the peak point is 1.5 KGauss to 2.5 KGauss.

3. A microwave plasma etching apparatus according to claim 1, wherein the magnetic field intensity of the peak point to the magnetic field intensity of the cyclotron resonance point have a ratio in the range of 2 to 3.

4. A microwave plasma etching apparatus according to claim 1, further comprising a shielding filter positioned between the peak point of the magnetic field and the reaction chamber for containing the microwave power in the plasma gnerating chamber and the connecting chamber, the shielding filter having a plurality of holes extending in parallel with the axis of the connecting chamber for allowing the passage of said radicals and ions generated in the plasma.

5. A microwave plasma etching apparatus according to claim 1, wherein the generating means comprises at least one solenoid.

6. A microwave plasma etching apparatus according to claim 4, wherein the plasma chamber, the connecting chamber, the reaction chamber, and the shielding filter are formed of aluminum.

7. A microwave plasma etching apparatus according to claim 1, wherein the predetermined pressure of the gas is less than approximately 10^-3 Torr.

8. A microwave plasma etching apparatus according to claim 1, wherein the connecting chamber forms an aperature for collimating the free radicals and ions so that the free radicals and ions impinge the workpiece in a direction substantially perpendicular to the workpiece.

9. A microwave plasma etching apparatus according to claim 1, wherein the generating means is a means for generating an additional peak point of the magnetic field intensity located at the opposite side of the plasma chamber from the connecting chamber, for confining the the plasma to the central portion of the plasma generating chamber.

10. A microwave plasma etching apparatus according to claim 1, wherein the generating means is means for generating a magnetic field having a convex intensity profile along the axis of the connecting chamber.

11. A microwave plasma etching apparatus according to claim 1, further comprising a sub-plasma chamber in communication with plasma generating chamber, positioned at an end of the plasma generating chamber opposite from the connecting chamber, wherein the generating means is means for generating a magnetic field having an additional peak point of the magnetic field intensity in the sub-plasma chamber which functions as an additional magnetic mirror for reflecting the electrons, and an additional magnetic mirror for reflecting the electrons, and an additional cyclotron resonance point in the plasma generating chamber.

12. A microwave plasma etching apparatus according to claim 11, wherein the generating means is a means for generating a magnetic field having a concave intensity profile along the axis of the connecting chamber.

13. A microwave plasma etching apparatus according to claim 11, wherein the connecting chamber has a length in the direction of the axis of the connecting chamber and a width, and wherein the ratio of the length to the width is set so that the connecting chamber collimates particles traveling from the plasma generating chamber to the reaction chamber.

14. A microwave plasma etching apparatus, comprising:

a plasma generating chamber filled to a predetermined pressure with an ionizable gas;

means for applying microwave power to the plasma generating chamber to create a plasma in the ionizable gas, the plasma including ions, free radicals and electrons;

a reaction chamber;

connecting chamber means having an axis and connecting the plasma generating chamber and the reaction chamber for collimating ions and free radicals passing from the plasma generating chamber to the reaction chamber;

means, positioned in the reaction chamber, for holding a workpiece at a predetermined position in line with the axis of the connecting chamber and electrically isolating the workpiece; and

means for generating a magnetic field having a peak magnetic field intensity point at which the magnetic field functions as a magnetic mirror for containing electrons in the plasma in the plasma generating chamber, and having a cyclotron resonance point in the plasma generating chamber for imparting a cyclotron motion to the electrons in the plasma generating chamber.

15. A microwave plasma etching apparatus according to claim 14, wherein the generating means includes a solenoid positioned around the connecting means.

16. A microwave plasma etching apparatus according to claim 14, further comprising a sub-plasma chamber in communication with the plasma generating chamber at an end of the plasma generating chamber opposite from the connecting means, wherein the generating means is a means for generating a magnetic field having an additional peak magnetic field intensity point in the sub-plasma chamber which functions as an additional magnetic mirror for reflecting the electrons, and having an additional cyclotron resonance point in the plasma generating chamber for imparting a cyclotron motion to the elections in the plasma generating chamber.

17. A microwave plasma etching apparatus according to claim 16, wherein the generating means includes a first solenoid positioned to surround the connecting means and a second solenoid positioned to surround the sub-plasma chamber.

18. A method of anisotorpic plasma etching in a microwave plasma etching apparatus incuding a vacuum vessel having a plasma generating chamber, a reaction chamber, and a connecting chamber connecting the plasma generating chamber and the connecting chamber, the connecting chamber having an axis, comprising the steps of:

(a) evacuating the vacuum vessel and back-filling the vacuum vessel with an ionizable gas;

(b) applying microwave energy to the plasma generating chamber to generate a plasma; and

(c) generating a magnetic field having a cyclotron resonance point in the plasma generating chamber for causing a cyclotron resonance of electrons in the plasma corresonding to the predetermined frequency of the microwave power, and having a peak point in the connecting chamber at which said magnetic field intensity has a maximum value and functions as a magnetic mirror for reflecting the electrons in the plasma while allowing the free radicals and ions to pass the magnetic mirror along the axis of the connecting chamber to impinge on the workpiece, thereby to perform substantially anisotropic plasma etching of the workpiece.

19. A method according to claim 18, wherein step (c) includes generating a magnetic field having a convex intensity profile along the axis of the connecting chamber.

20. A method according to claim 18, wherein step (a) includes backfilling the vaccum vessel to a pressure of approximately 1×

10^-4 Torr.

21. A method according to claim 18, wherein step (c) includes generating a peak magnetic field intensity in the connecting chamber and generating a cyclotron resonance point in the plasma generating chamber.

22. A method according to claim 18, wherein step (c) includes generating a peak magnetic field intensity of approximately 1.5 to 2.5 KGauss and generating a magnetic field intensity of approximately 875 Gauss at the cyclotron resonance point.

23. A method according to claim 18, wherein step (b) includes applying microwave energy of 2.45 GHz.

24. A method according to claim 21, wherein step (c) includes generating the peak magnetic field intensity so that it is approximately 2 to 3 times larger than the magnetic field intensity of the cyclotron resonance point.