Process monitor and method thereof

• US 4,611,919 A
• Filed: 03/09/1984
• Issued: 09/16/1986
• Est. Priority Date: 03/09/1984
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Tegal Corp. (Rennova Health, Inc.)
• Inventors: Brooks, Edward A. Jr., Bithell, Roger M.
• Primary Examiner(s): Willis, Davis L.
• Assistant Examiner(s): Koren, Matthew W.
• Application Number:
  US06/588,028
• Time in Patent Office: 921 Days
• Field of Search: 356/357, 356/369, 356/382, 156/626, 156/627
• US Class Current: 356/504
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer

Abstract

A process monitor which is particularly useful for endpoint detection in plasma etching processes does not require the dedication of a test area on the wafer for endpoint detection and also obviates the need for wafer alignment. An improved optical window which does not significantly perturb the RF fields in the plasma chamber is also disclosed. The apparatus reflects laser energy off an area of the wafer comparable to the area of a typical die and extracts the necessary information from the resulting waveform by means of first and second time derivatives.

Claims

1. Apparatus for monitoring the change in thickness of an article in at least a portion of one surface thereof while that surface is subjected to a process, said apparatus comprising:

means for illuminating a portion of said surface with coherent electromagnetic energy;

means for detecting a portion of the energy reflected from said surface and for producing an electrical signal proportional thereto;

means for identifying points in said electrical signal corresponding to points in said process at which a particular relationship obtains between said thickness and the wavelength of said coherent energy;

means for altering said process upon identifying a certain number of said points, and

means for generating a second signal, proportional to the first derivative with respect to time of said electrical signal, and wherein said means for identifying utilizes said second signal for identifying said points.

2. The apparatus as set forth in claim 1 wherein said means for illuminating comprises:

a first window through which incident and reflected electromagnetic energy passes;

a second window through which incident and reflected electromagnetic energy passes; and

wherein said detecting means comprises first and second photodetectors optically coupled one to each of said windows.

3. The apparatus as set forth in claim 2 wherein said altering means further comprises means responsive to differences in signals from said photodetectors.

4. The apparatus as set forth in claim 3 and further comprising a plasma reactor having at least one conductive electrode for containing said windows.

5. The apparatus as set forth in claim 4 wherein said windows comprise:

a reduced thickness portion in one of said electrodes;

a plurality of holes in the reduced thickness portion; and

an optically transparent, electrically conductive material covering said holes and sealed into said reduced thickness portion.

6. The apparatus as set forth in claim 5 and further comprising:

an optical fiber bundle interconnecting said window, said detecting means, and said illuminating means.

7. The apparatus as set forth in claim 6 wherein said optical fiber bundle is divided between said illuminating means and said detector means at one end and wherein the other end of substantially all of the fibers in said bundle is coupled to said window.

8. A method for monitoring the change in thickness of an article, subjected to a process which acts upon at least one surface of said article, comprising the steps of:

illuminating a portion of said surface with coherent radiation;

detecting radiation reflected from said surface and producing an analog signal proportional thereto;

wherein said illuminating detecting steps are carried out at more than one location on said surface to produce several analog signals; and

identifying points in said analog signals indicative of predetermined changes in thickness.

9. The method as set forth in claim 8 and further comprising the step of:

varying said process to reduce variations in thickness as indicated by said analog signals.

10. A plasma etch process monitor comprising:

means for illuminating with coherent electromagntic energy a semiconductor wafer;

said means including a first optical window for illuminating a central portion of said wafer and to collect energy reflected therefrom and a second optical window for illuminating an edge portion of said wafer and to collect energy reflected therefrom;

means for generating analog signals related to the intensity of the energy reflected from said central portion and the edge portion of said wafer, respectively;

each analog signal having superposed large and small amplitude components;

means for identifying maxima of said small amplitude periodic component; and

means for altering said etch process upon identifying a certain number of said maxima.