Position sensor for fuel injection apparatus

• US 4,614,111 A
• Filed: 02/15/1985
• Issued: 09/30/1986
• Est. Priority Date: 02/15/1985
• Status: Expired due to Term

• Current Assignee: George D. Wolff
• Original Assignee: George D. Wolff
• Inventors: Wolff, George D.
• Primary Examiner(s): MYRACLE, JERRY
• Application Number:
  US06/701,935
• Time in Patent Office: 592 Days
• Field of Search: 73/119 A, 73/DIG. 3, 239/73, 239/533.3, 239/533.4, 330/6, 340/870.31, 29/595
• US Class Current: 73/114.47
• CPC Class Codes: F02M 65/005 Measuring or detecting injection-valve lift, e.g. to determine injection timing
• CPC Class Codes: G01B 7/003 for measuring position, not involving coordinate determination coordinate measuring G01B7/004
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

A sensor assembly for detecting the position of a fuel injection element such as a needle injector, poppet valve or the like in fuel injection apparatus of an internal combustion engine includes a lead frame assembly having a plurality of leads of a predetermined length and a Hall-effect sensing device mechanically and electrically connected to contact surfaces associated with the leads. A first encapsulation layer is formed about the contact surfaces and Hall-effect device utilizing a mold process which results in the formation of projections above the surface of the Hall-effect device in the area adjacent the electrical contacts. The leads of the lead frame assembly are bent perpendicularly to the plane of the Hall-effect device and attached to a multi-lead wire. The assembly is encapsulated in a second mold using the projections as positive stops to position the assembly in the mold. An end of the multi-lead wire, the leads and the Hall-effect device are all thereby encapsulated and dimensioned for insertion into and out of a passageway and fuel injection apparatus.

Claims

1. A sensor assembly for detecting the position of a fuel injection device in a fuel injection apparatus of an internal combustion engine, said sensor comprising:

an integrated circuit sensing element;

a lead frame assembly having a plurality of leads of a predetermined length;

electrically conductive means attaching contact pads on said integrated circuit sensing element to corresponding ones of said leads;

first encapsulating means about said sensing element and a portion of said leads, said first encapsulating means forming projections above a surface of said sensing element;

a multi-lead wire having a plurality of lead wires, each of said lead wires having an end attached to a corresponding one of said leads of said lead frame assembly; and

second encapsulation means about said sensing element, said lead frame assembly and said end of said multi-lead wire forming said sensor assembly, a face of said sensor assembly being coterminous with peaks of said projections.

2. The sensor assembly of claim 1 wherein said sensing element comprises a Hall-effect sensor.

3. The sensor assembly of claim 1 wherein each of said leads of said lead frame assembly are perpendicular to a plane of a surface of said sensing element.

4. The sensor assembly of claim 1 wherein said sensor assembly is dimensioned for insertion into and out of said fuel injection device.

5. The sensor assembly of claim 1 wherein said projections are formed over said electrically conductive means.

6. The sensor assembly of claim 1 wherein said leads of said lead frame assembly have partially etched areas adjacent said first encapsulation to facilitate bending.

7. The sensor assembly of claim 1 wherein said leads of said lead frame assembly have perforated areas adjacent said first encapsulation to facilitate bending.

8. The sensor assembly of claim 1 wherein said leads extend through said first encapsulation and are enclosed within said second encapsulation.

9. The sensor assembly of claim 1 wherein said lead frame assembly is plated.

10. The sensor assembly of claim 9 wherein the lead frame assembly is plated only in areas used for electrical bonding.

11. The sensor assembly of claim 1 wherein said first and second encapsulating means comprises a transfer-molding insulating material.

12. The sensor assembly of claim 1 wherein said first encapsulation means includes radial corners for positioning the assembly in a mold for forming said second encapsulation means.

13. The sensor assembly of claim 12 wherein said radial corners are located on a circumference of a circle.

14. The sensor assembly of claim 13 wherein a diameter of said circle is substantially equal to an outside diameter of said multi-lead wire.

15. The sensor assembly of claim 1 wherein said projections are conical.

16. A sensor assembly for detecting the position of valve means in fluid control apparatus, of a fuel injection apparatus, said sensor assembly comprising:

an integrated circuit sensing element;

a lead frame assembly having a plurality of leads;

electrically conductive means attaching contact pads on said integrated circuit sensing element to corresponding ones of said leads; and

encapsulation means formed about said sensing element and a portion of said leads, said encapsulation means forming projections above a surface of said sensing element, peaks of said projections defining a plane for positioning said sensing element a predetermined distance from an end surface of said sensor.

17. The sensor assembly of claim 16 wherein the valve means in fluid control apparatus comprises diesel fuel injection means in fuel injection apparatus of an internal combustion engine.

18. The sensor assembly of claim 17 wherein said sensor assembly includes conductor means electrically connected to said leads for transmitting signals from said sensing element.

19. The sensor assembly of claim 18 wherein said encapsulation means comprises:

first encapsulation means about said sensing element and a portion of said leads said first encapsulation means forming said projections; and

second encapsulation means about said first encapsulation means and a portion of said conductor means, said second encapsulation means having a first surface coterminous with said peaks of said projections for establishing said plane.

20. The sensor assembly of claim 19 wherein said conductor means comprises a multi-lead wire having a plurality of lead wires, each of said lead wires being attached to a corresponding one of said leads of said lead frame assembly.