Component module for piggyback mounting on a circuit package having dual-in-line leads, and methods of fabricating same

• US 4,617,708 A
• Filed: 04/02/1985
• Issued: 10/21/1986
• Est. Priority Date: 12/23/1982
• Status: Expired due to Term

• Current Assignee: AT&T Technologies Inc (Nokia Corporation)
• Original Assignee: AT&T Technologies Inc (Nokia Corporation)
• Inventors: Fanning, William J.
• Primary Examiner(s): Rosenbaum, Mark
• Assistant Examiner(s): ECHOLS, PERCY W
• Application Number:
  US06/704,700
• Time in Patent Office: 567 Days
• Field of Search: 29/827, 29/832, 29/835, 29/837-841, 29/854-856, 29/25.41, 29/25.42, 361/588, 361/589, 361/591, 361/386, 361/389, 361/405, 361/421, 174/52 FP, 174/52 PE, 264/272.11, 264/272.14, 264/272.15, 264/272.17, 264/272.18, 339/17 CF, 339/258 R, 357/70
• US Class Current: 29/25.42
• CPC Class Codes: H01L 2225/1029 the support being a lead frame
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/49589 Capacitor integral with or on the leadframe
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/1053 Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive
• CPC Class Codes: H05K 2203/0415 Small preforms other than balls, e.g. discs, cylinders or pillars
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 7/1092 with built-in components, e.g. intelligent sockets
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 : and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49142 : including metal fusion
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material

Abstract

A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP. In one component module embodiment (15, FIG. 1), the terminals (26-29) are adapted for soldered securement to a circuit board (54), whereas in a second embodiment (70, FIG. 6) the terminals (76-79) are adapted to be snap-locked on and, thereafter, soldered to, upper horizontal shoulder portion (82a) of respectively aligned leads (82) of a supporting DIP (81).

Claims

1. A method of fabricating a component module for piggyback mounting on, and interconnection with, an integrated circuit package of the type having dual-in-line leads, said method comprising the steps of:

partially blanking at least first and second oppositely directed and longitudinally spaced terminals out of an elongated strip stock carrier, each of said terminals including a first outwardly disposed leg portion, a second inwardly disposed leg portion, and at least a third leg portion that extends perpendicularly to said second leg portion;

forming the third leg portion of each of said terminals into a contact member for electrically engaging opposite end electrodes of a component and for providing temporary support for such a component;

positioning the body portion of the component between the second leg portions of said terminals such that said component is supported by, and its opposite end electrodes are respectively biased against, the contact members of said terminals;

completely serving said first and second terminals from said strip stock carrier, while clamping at least the outermost ends of the first leg portions of said terminals such that they remain in a common plane;

encapsulating said component, including its electrodes and said terminal contact members, within a molded housing with at least a major part of the second leg portion of each terminal embedded in said housing; and

bending the first leg portions of said terminals downwardly from respective regions adjacent to two diagonally disposed corners of said housing, the resulting spacing between the first leg portions of said first and second terminals being selected so that said terminals will respectively contact selected correspondingly disposed leads of an associated integrated circuit package, having dual-in-line leads, when said fabricated component module is subsequently piggyback-mounted thereon.

2. A method in accordance with claim 1 wherein said component comprises a capacitor, and wherein said forming step comprises forming each of said contact members into a C-shaped configuration for supporting the capacitor and contacting its end electrodes.

3. A method in accordance with claim 1 wherein the blanking and severing steps include forming out of said strip carrier a rectangularly shaped and electrically isolated heat sink positioned so as to be beneath said component, and wherein the encapsulating step comprises at least partially embedding the heat sink in said molded housing.

4. A method in accordance with claim 1 wherein during said partial blanking step, the first leg portion of each of said first and second terminals is formed with a resilient, bifurcated end region, said end region defining two laterally spaced and resilient leg sections that are configured to form a necked-down opening therebetween which communicates with a laterally disposed slot that is also formed by said leg sections, said slot being wider than the narrowest inner width of said opening immediately adjacent thereto, and also being dimensioned so as to allow a shoulder portion of a rectangularly shaped circuit package lead to be readily snapped therein after having been forced through the communicating opening.