Process for soldering a current connecting element and a current feed conductor of a heatable glass pane

• US 4,618,088 A
• Filed: 12/07/1984
• Issued: 10/21/1986
• Est. Priority Date: 12/13/1983
• Status: Expired due to Fees

• Current Assignee: Saint Gobain Vitrage (Compagnie De Saint-Gobain S.A.)
• Original Assignee: Saint Gobain Vitrage (Compagnie De Saint-Gobain S.A.)
• Inventors: Karla, Heinz
• Primary Examiner(s): Ramsey, Kenneth J.
• Assistant Examiner(s): McKee, Christopher L.
• Application Number:
  US06/679,170
• Time in Patent Office: 683 Days
• Field of Search: 220/203, 220/206, 220/124, 220/207, 156/663, 156/667, 219/203, 219/522, 219/543, 338/309
• US Class Current: 228/124.1
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01R 43/02 for soldered or welded connections

Abstract

A process for improving the solderability of a layer of a silver frit burnt onto a glass pane and a current connecting element wherein a layer of enamel is disposed and the surface of soldering and the glass pane. According to the process the surface is treated with a fluorine containing etching agent prior to soldering. The fluorine containing etching agent may be an aqueous solution of an acid fluoride, such as ammonium hydrogen fluoride or alkali hydrogen fluoride.

Claims

1. A process for soldering a current connecting element to an enamel-like, electrically conducting layer burnt onto a surface of a glass pane, said electrically conducting layer being disposed on an enamel-like layer which is, in turn, located between the surface of the glass pane and the electrically conducting layer, said process characterized in treating the surface of the electrically conducting layer with a fluorine containing etching agent, said treatment being at the place provided for soldering, and soldering a foot of the current connecting element to said electrically conducting layer at said treated surface.

2. The process of claim 1 wherein the fluorine containing etching agent is an aqueous solution of an acid fluoride.

3. The process of claim 2 wherein the aqueous solution of an acid fluoride is one of an alkali hydrogen fluoride and an ammonium hydrogen fluoride.

4. The process of claim 3 wherein the aqueous solution of an acid fluoride comprises an approximately 10% aqueous solution of ammonium fluoride.

5. The process of one of the claims 1 to 4 wherein a stamp is wetted or saturated with the fluorine containing etching agent.

6. The process of claim 5 wherein said enamel-like electrically conducting layer comprises a current feed conductor of an electrically heatable glass pane.