Laser interferometer system and method for monitoring and controlling IC processing

• US 4,618,262 A
• Filed: 04/13/1984
• Issued: 10/21/1986
• Est. Priority Date: 04/13/1984
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Kaczorowski, Edward M., Maydan, Dan, Somekh, Sasson
• Primary Examiner(s): McGraw, Vincent P.
• Assistant Examiner(s): TURNER, SAMUEL A
• Application Number:
  US06/600,189
• Time in Patent Office: 921 Days
• Field of Search: 356/354, 356/355, 356/357, 356/358, 356/359, 356/400, 356/375, 156/626, 250/548, 250/561
• US Class Current: 356/504
• CPC Class Codes: G01B 11/0675 using interferometry

Abstract

A laser interferometer system and associated method for etching endpoint detection, and for monitoring etching or growth to a selected depth. The process implemented by the system involves scanning the laser beam across scribe lines on a wafer which is undergoing fabrication (growth or etching) and monitoring the resulting interference pattern. Alternatively, the process implemented by this system involves moving the laser beam across the scribe line to detect the position of the scribe line; locking the laser beam on the scribe line; and monitoring the resulting interference pattern.

Claims

1. A process for monitoring the change in thickness of a layer of material being fabricated on a substrate as by one of etching, growth or deposition, based upon the change in thickness of the layer on a substrate scribe line or other selected feature, comprising focusing a laser beam to a beam spot on the substrate, the focused beam spot being of a small size selected based upon the size of the selected feature, for providing an enhanced signal-to-noise ratio;

repetitively scanning the beam spot across the selected feature to generate an optical interference signal characteristic of the repetitive scanning and the thickness of the selected substrate feature; and

converting the optical signal into a corresponding electrical signal adapted for monitoring the fabrication process.

2. The monitoring process of claim 1 wherein the optical signal contains peak which are characteristic of the selected substrate feature.

3. The monitoring process of claim 1 wherein the optical signal is cyclical, characteristic of the changing thickness of the layer being fabricated.

4. The monitoring process of claim 1 wherein the optical signal results from and is characteristic of optical diffraction.

5. The monitoring process of claim 1 wherein the optical signal results from and is characteristic of optical reflection.

6. The monitoring process of claim 1 wherein the scanning is started before starting the fabrication of the layer.

7. The monitoring process of claim 1 wherein the scanning is started after starting the fabrication of the layer.

8. The monitoring process of claim 1 wherein the process comprises etching of the material of the layer from at least a region over the substrate and wherein the electrical signal corresponds to substantially complete removal of the thickness of the layer from the region.

9. The monitoring process of claim 1 wherein the fabrication process comprises etching of the material of the layer from at least a region over the substrate and wherein the electrical signal corresponds to removal of a selected thickness of the material.

10. The monitoring process of claim 1 wherein the fabrication process comprises growth or deposition of the material of the layer over at least a selected area of the substrate and wherein the electrical signal corresponds to the formation of a selected thickness of the material.

11. The monitoring process of claim 1 wherein the laser beam is adjustably focused.

12. The monitoring process of claim 8 wherein the electric output signal drives a corresponding graphical display of the process monitoring information.

13. A process for monitoring the change in thickness of a layer of material being fabricated on a substrate as by one of etching, growth or deposition, based upon the change in thickness of the layer over a substrate scribe line or other selected feature, comprising focusing a laser beam to a beam spot on the substrate, the focused beam spot being of a small size selected based upon the size of the selected feature, for providing a high signal-to-noise ratio;

controllably moving the beam spot across the substrate to intersect the selected substrate feature while monitoring the resulting first optical interference signal;

stopping the movement of the beam spot upon reaching a predetermined value of the optical signal characteristic of the selected substrate feature to thereby focus the beam on the selected substrate feature;

fabricating the layer and thereby generating a second optical signal characteristic of the changing thickness of the layer; and

converting the second optical interference signal into a corresponding electrical signal for monitoring the fabrication process.

14. The process of claim 13 wherein the first optical signal comprises peak values, characteristic of the moving beam spot intersecting the selected substrate feature.

15. The monitoring process of claim 13 wherein the second optical signal results from, and is characteristic of, optical diffraction.

16. The monitoring process of claim 13 wherein the second optical signal results from, and is characteristic of, optical relection.

17. The process of claim 13 wherein the second optical signal is cyclical, characteristic of the changing thickness of the layer being fabricated.

18. The monitoring process of claim 13 wherein the electrical signal represents the time rate of change of thickness.

19. The monitoring process of claim 17, further comprising the step of stopping the fabrication process upon reaching a selected number of signal cycles.

20. The monitoring process of claim 19, wherein the process comprises etching the material of the layer from at least a region over the substrate, and wherein the selected number of cycles corresponds to substantially complete removal of the thickness of the layer from the region.

21. The monitoring process of claim 19 wherein the fabrication process comprises etching of the material of the layer from at least a region over the substrate and wherein the selected number of cycles corresponds to removal of a selected thickness of the material.

22. The monitoring process of claim 19 wherein the fabrication process comprises growth or deposition of the material of the layer over at least a selected area of the substrate, and wherein the selected number of cycles corresponds to the formation of a selected thickness of material.

23. The monitoring process of claim 20 wherein the electric output signal drives a corresponding graphical display of the process monitoring information.

24. A process for monitoring the varying thickness of a layer of material being fabricated on a semiconductor substrate, comprising scanning a focused beam of collimated light in a reciprocal path between scribe lines on the substrate while monitoring the resulting optical interference pattern of peak values;

the scanning path length being longer than the distance thereon between adjacent scribe lines and the cross-sectional width of the focused beam being substantially the same dimension as the width of the scribe line; and

stopping the fabrication process upon reaching a selected one of said peak values corresponding to a selected thickness change.

25. A process for monitoring the varying thickness of a layer of material being fabricated on a semiconductor substrate comprising moving a focused beam of collimated light along a path between scribe lines on the substrate while monitoring the resulting optical interference signal comprising at least a selected peak value;

the path length being longer than the distance thereon between adjacent scribe lines and the cross-sectional width of the focused beam being based upon the width of the scribe line;

stopping the scanning at the selected peak value to position the beam at a scribe line;

monitoring the resulting optical signal; and

stopping the fabrication process upon reaching a selected point corresponding to a selected thickness change.