Infrared focal plane module with stacked IC module body

• US 4,618,763 A
• Filed: 04/12/1985
• Issued: 10/21/1986
• Est. Priority Date: 04/12/1985
• Status: Expired due to Term

• Current Assignee: Grumman Aerospace Corporation (Northrop Grumman Corporation)
• Original Assignee: Grumman Aerospace Corporation (Northrop Grumman Corporation)
• Inventors: Schmitz, Charles E.
• Primary Examiner(s): LaRoche, Eugene R.
• Assistant Examiner(s): MIS, DAVID C
• Application Number:
  US06/722,776
• Time in Patent Office: 557 Days
• Field of Search: 250/211 R, 250/211 J, 250/211 K, 250/332, 250/338, 361/392, 361/393, 361/395, 361/397, 361/400, 361/409, 361/410, 361/412, 361/414
• US Class Current: 250/214.1
• CPC Class Codes: H01L 25/042 the devices being arranged next to each other solar cells H01L31/042
• CPC Class Codes: H01L 27/1446 in a repetitive configuration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An infrared detection module is disclosed for interfacing a plurality of detector elements to external electronics. The module is formed of a plurality of multi-channel integrated circuits stacked in substantially overlapping registry with adjacent integrated circuits separated by an insulating layer. Each integrated circuit is formed to have exposed conductive areas along first and second edge portions thereof. Each detector array segment is disposed transverse to the plane of the integrated circuits and connected to conductive areas on each integrated circuit along first edge portions thereof. A module header interface is disposed transverse to the plane of the integrated circuits and is electrically connected to the conductive areas along the integrated circuit second edge portions.

Claims

1. An infrared focal plane module for interfacing a plurality of detector elements to external electronics comprising:

a plurality of multi-channel integrated circuits disposed in substantially overlapping registry to form a module body, each of said integrated circuits having exposed conductive areas formed along first and second edge portions thereof;

a detector array segment disposed transverse to the plane of said integrated circuits in abutting electrical connection to said integrated circuit first edge portions;

a module header interface for facilitating connections between said integrated circuits and external electronics, said interface being disposed transverse to the plane of said integrated circuits in abutting electrical connection to said integrated circuit second edge portions; and

adhesive insulating layers disposed between adjacent integrated circuits.

2. The module as recited in claim 1 wherein said exposed conductive areas comprise interface pads formed on vertical edge portions of said integrated circuit.

3. The module as recited in claim 1 wherein each of said multi-channel integrated circuits is substantially identical.

4. The module as recited in claim 1 wherein each channel of said multi-channel integrated circuits is substantially identical.

5. The module as recited in claim 1 wherein each of said integrated circuits is electrically connected to a linear array of detector elements.

6. The module as recited in claim 1 wherein each integrated circuit is between 0.001 to 0.020 inches thick.

7. The module as recited in claim 1 wherein said detector array segment is formed of a plurality of detector elements, the center line spacing between said elements being equal to the thickness of one of said integrated circuits plus the thickness of one of said insulating layers.

8. The module as recited in claim 1 wherein said detector array segment is formed of a plurality of detector elements, said detector elements having center line spacing between 0.002 to 0.020 inches.

9. A sub-array of infrared detection modules comprising:

a plurality of infrared detection modules for interfacing a plurality of detector elements to external electronics, each of said modules comprising;

a plurality of multi-channel integrated circuits disposed in substantially overlapping registry, each of said integrated circuits being separated by a layer of adhesive electrical insulation, and having exposed conductive areas formed along first and second edge portions thereof;

a planar detector array portion disposed transverse to the plane of said integrated circuits and in abutting electrical connection with said integrated circuit first edge portions; and

a header interface disposed transverse to the plane of said integrated circuits and in abutting electrical connection with said integrated circuit second edge portions, said header interface being adapted to communicate electrical signals between said integrated circuit and external electronics.

10. The sub-array as recited in claim 9 further including a layer of insulating adhesive disposed between adjacent modules.

11. The sub-array as recited in claim 9 wherein each of said integrated circuits comprises an insulating substrate having a pattern of semi-conductor material formed thereon.

12. The sub-array as recited in claim 11 wherein said insulating substrate comprises a layer of sapphire.

13. The sub-array as recited in claim 9 wherein each of said modules have a length and width equal to the detector center line spacing multiplied by the number of detector elements along one side of the detector, and a depth appropriate to the complexity of the on focal plane signal processing requirements.

14. The sub-array as recited in claim 9 wherein each of said modules is approximately 0.128 inches long, 0.128 inches wide, and 0.5 inches deep.

15. A process for forming an infrared detection module comprising:

forming a plurality of substantially identical integrated circuits;

forming exposed conductive areas on first and second edge portions of said integrated circuits;

stacking said integrated circuits in substantially overlapping registry;

disposing an adhesive insulating layer between adjacent integrated circuits;

disposing a planar array segment of infrared detectors transverse to the plane of said integrated circuits, said array segment being in abutting electrical connection with said integrated circuit first edge portions;

disposing a header interface transverse to the plane of said integrated circuits, said header interface being in abutting electrical connection with said integrated circuit second edge portions and adapted to communicate signals between said integrated circuits and external electronics.