Vacuum pick for semiconductor wafers

• US 4,620,738 A
• Filed: 08/19/1985
• Issued: 11/04/1986
• Est. Priority Date: 08/19/1985
• Status: Expired due to Term

• Current Assignee: Varian Semiconductor Equipment Associates Incorporated (Applied Materials Incorporated)
• Original Assignee: Varian Associates, Inc. (Siemens AG)
• Inventors: Schwartz, Vladimir, Freytsis, Avrum
• Primary Examiner(s): Marbert, James B.
• Application Number:
  US06/766,458
• Time in Patent Office: 442 Days
• Field of Search: 294/64.1, 294/64.2, 294/64.3, 294/65, 271/90, 271/93, 271/107, 271/132, 414/114, 414/121, 414/752, 414/787, 269/21, 279/3
• US Class Current: 414/752.1
• CPC Class Codes: B65G 47/91 incorporating pneumatic, e.g. suction, grippers

Abstract

A vacuum pick suitable for removing semiconductor wafers from and replacing wafers in a cassette holder. The vacuum pick includes a thin profile housing having a wafer support surface with a cavity therein, a resilient, flexible member covering a portion of the cavity to form an enclosure, and a rigid chuck mounted on the flexible member so as to permit movement of the chuck relative to the housing. The chuck includes a wafer-receiving surface connected through a passage to the enclosure. When a vacuum is applied to the enclosure, the wafer and the chuck are retracted against the housing and held firmly in place. The chuck tilts relative to the housing when it contacts a tilted wafer, thereby insuring reliable attachment to the wafer.

Claims

1. A vacuum pick comprising:

a housing having a workpiece support surface with a cavity therein;

a resilient flexible member covering at least a portion of the cavity to form an enclosure;

a rigid chuck mounted on the flexible member to permit movement of the chuck relative to the housing, the chuck having a substantially flat surface portion for receiving a workpiece;

vacuum source means connected to the enclosure, the chuck and the flexible member having a passage therethrough providing a fluid connection between the surface portion of the chuck and the enclosure, the chuck having an extended position when vacuum is not applied to the enclosure and a retracted position when vacuum is applied to the enclosure, the workpiece being drawn against the support surface of the housing when the chuck is in the retracted position.

2. The vacuum pick as defined in claim 1 wherein the workpiece support surface of the housing and the surface portion of the chuck are substantially coplanar in the retracted position.

3. The vacuum pick as defined in claim 2 wherein the housing is elongated with the cavity, the flexible member and the chuck positioned near one end thereof.

4. The vacuum pick as defined in claim 3 wherein the housing has a thin profile adapted for access between closely-spaced workpieces.

5. The vacuum pick as defined in claim 4 adapted for holding semiconductor wafers.

6. The vacuum pick as defined in claim 5 wherein the housing includes a fluid passage for connecting a vacuum source to the enclosure.

7. The vacuum pick as defined in claim 6 wherein the cavity has a shallow cylindrical shape.

8. The vacuum pick as defined in claim 7 wherein the chuck is generally disk-shaped with a diameter smaller than that of the cavity.

9. The vacuum pick as defined in claim 8 wherein the surface portion of the chuck has a recessed area.

10. The vacuum pick as defined in claim 9 wherein the vacuum source means includes control means for applying vacuum to the enclosure when holding of a wafer is desired.