Card with an IC module

• US 4,621,190 A
• Filed: 06/07/1984
• Issued: 11/04/1986
• Est. Priority Date: 06/09/1983
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kobayashi, Hiroshi, Saito, Tamio, Hori, Shigekazu
• Primary Examiner(s): TRAFTON, DAVID
• Application Number:
  US06/618,381
• Time in Patent Office: 880 Days
• Field of Search: 235/492, 235/455, 235/441, 235/379, 235/380
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07 with integrated circuit chips
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

The credit card includes an IC module having a data processing function, an insulation body for holding the IC module, and a plurality of terminals which are formed on the insulation body. The plurality of terminals are first and second contact pads to which a drive power and a data signal are supplied. The IC module is formed between the first and second contact pads.

Claims

1. A card comprising:

an insulation substrate;

an IC module which is formed in said insulation substrate and has data processing means for generating an output signal in accordance with an input signal; and

first and second conductive layers which are respectively formed on the substantially entire upper and bottom surfaces of said insulation substrate in contact with said IC module, and between which a drive power and input and output signals of said IC module are supplied.

2. A card according to claim 1, wherein said data processing means includes first and second electrodes respectively connected to said first and second conductive layers, an extraction circuit for separating the input signal from a composite of the drive power and input signals supplied from said first and second electrodes, and a data processing circuit which generates a reply data in accordance with the extracted input signal, and an output circuit for supplying to said first and second electrodes the output signal corresponding to the reply data.

3. A card according to claim 1, wherein said IC module further has a diode for blocking a reverse current to flow in said data processing means.

4. A card according to claim 1, wherein said IC module further has compensation means for compensating for the fluctuation of resistance of said data processing means.

5. A card according to claim 4, wherein said compensation means has a resistor connected to said data processing means in parallel.

6. A card according to claim 4, wherein said compensation means has a resistor connected to said data processing means in series.

7. A card according to claim 4, wherein said compensation means has a detector circuit which produces a control signal in accordance with the resistance of said data processing means, and a variable resistor circuit which is connected in parallel to said data processing means and generates a resistance in accordance with said control signal.

8. A card according to claim 4, wherein said compensation means has a detector circuit which produces a control signal in accordance with the resistance of said data processing means, and a variable resistor circuit which is connected in series to said data processing means and generates a resistance in accordance with said control signal.

9. A card according to claim 1, wherein said IC module has a monolithic construction.

10. A card according to claim 2, wherein said first and second conductive layers are formed of metal.

11. A card according to claim 10, wherein said first and second electrodes are respectively formed on the upper and bottom surfaces of said IC module.

12. A card according to claim 11, wherein said first and second electrodes are respectively connected to said first and second regions through conductive members having a resiliency.

13. A card according to claim 12, wherein said conductive members are conductive rubbers.

14. A card according to claim 12, wherein said conductive members are metal springs.

15. A card according to claim 13, wherein said first and second conductive layers have a plurality of projections formed in contact with said first and second electrodes of said IC module.

16. A card according to claim 2, wherein said first and second conductive layers, have a resiliency.

17. A card according to claim 1, wherein said insulation substrate is formed in a circular form.

18. A card comprising:

an insulation substrate;

an IC module which is formed in said insulation substrate and has data processing means for generating a predetermined output signal; and

first and second conductive layers which are respectively formed on the substantially entire upper and bottom surfaces of said insulation substrate in contact with said IC module, and between which a drive power and output signal of said IC module are supplied.

19. A card according to claim 18, wherein said data processing means includes first and second electrodes respectively connected to said first and second conductive layers, a data processing circuit which generates predetermined data when the drive power is applied from said first and second electrodes, and an output circuit for supplying to said first and second electrodes the output signal corresponding to the predetermined data.