Card with an IC module
First Claim
Patent Images
1. A card comprising:
- an insulation substrate;
an IC module which is formed in said insulation substrate and has data processing means for generating an output signal in accordance with an input signal; and
first and second conductive layers which are respectively formed on the substantially entire upper and bottom surfaces of said insulation substrate in contact with said IC module, and between which a drive power and input and output signals of said IC module are supplied.
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Abstract
The credit card includes an IC module having a data processing function, an insulation body for holding the IC module, and a plurality of terminals which are formed on the insulation body. The plurality of terminals are first and second contact pads to which a drive power and a data signal are supplied. The IC module is formed between the first and second contact pads.
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Citations
19 Claims
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1. A card comprising:
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an insulation substrate; an IC module which is formed in said insulation substrate and has data processing means for generating an output signal in accordance with an input signal; and first and second conductive layers which are respectively formed on the substantially entire upper and bottom surfaces of said insulation substrate in contact with said IC module, and between which a drive power and input and output signals of said IC module are supplied. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A card comprising:
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an insulation substrate; an IC module which is formed in said insulation substrate and has data processing means for generating a predetermined output signal; and first and second conductive layers which are respectively formed on the substantially entire upper and bottom surfaces of said insulation substrate in contact with said IC module, and between which a drive power and output signal of said IC module are supplied. - View Dependent Claims (19)
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Specification