Chip carrier for high frequency power components cooled by water circulation

• US 4,622,621 A
• Filed: 12/09/1985
• Issued: 11/11/1986
• Est. Priority Date: 12/11/1984
• Status: Expired due to Term

• Current Assignee: Thomson-CSF (Thales SA)
• Original Assignee: Thomson-CSF (Thales SA)
• Inventors: Barre, Lucien
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US06/807,019
• Time in Patent Office: 337 Days
• Field of Search: 357/72, 357/81, 357/82, 174/16 HS, 174/15 R, 174/16 R, 174/52 FP, 174/52 PE, 339/112 R, 339/112 L, 165/80.3, 165/80.4, 165/185, 165/104.33, 361/382-389, 361/400, 361/401, 361/403, 361/405
• US Class Current: 361/689
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating

Abstract

A chip carrier is provided for power components operating at high frequency, comprising a main heat conducting body with a cavity in which said component is housed, and forced flow fluid ducts. The chip carrier is inserted in a window cut out in a printed circuit board. A projecting flange bears against the edge of the window, whereas flat electrodes, extending from the carrier in the same plane as the flange, bear against connections printed on the board. Below the board, the cooling fluid forced flow channels are connected to delivery and discharge ducts.

Claims

1. In a chip carrier for power electronic components, comprising a heat conducting main body having a cavity for housing at least one component, as well as recesses formed in the main body and apertures for access to these recesses for introducing and discharging a forced flow cooling fluid,

2. over a part of its periphery, said main body is provided with a projecting flange having a lower flat surface forming a bearing surface on which the body of the chip carrier is inserted in a window cut out in a printed circuit board;

3. over another part of the periphery of the main body, flat electrodes extend from the cavity, in which they are connected to the component, these electrodes having their lower face situated in the plane of said bearing face so that when the body of the chip carrier is inserted in said window the electrodes come to bear against connections printed on the board, which connections extend substantially to the edge of the window;

4. apertures for access to said recesses are placed below the plane of the bearing surface and at a sufficient distance from this plane for it to be possible, when the body of the chip carrier is placed in the window of the board, to connect to these apertures fluid delivery and discharge ducts which are consequently situated on the other side of the supporting board with respect to the flat electrodes.