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Chip carrier for high frequency power components cooled by water circulation

  • US 4,622,621 A
  • Filed: 12/09/1985
  • Issued: 11/11/1986
  • Est. Priority Date: 12/11/1984
  • Status: Expired due to Term
First Claim
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1. In a chip carrier for power electronic components, comprising a heat conducting main body having a cavity for housing at least one component, as well as recesses formed in the main body and apertures for access to these recesses for introducing and discharging a forced flow cooling fluid,

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