Continuous gas plasma etching apparatus and method

• US 4,624,738 A
• Filed: 07/12/1985
• Issued: 11/25/1986
• Est. Priority Date: 07/12/1985
• Status: Expired due to Fees

• Current Assignee: et Plasma Incorporated
• Original Assignee: E-Plasma, LLC
• Inventors: Westfall, Raymond T., Feldl, Erich J.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/754,854
• Time in Patent Office: 501 Days
• Field of Search: 156/643, 156/646, 156/668, 156/345, 156/654, 156/902, 204/192 E, 204/298, 427/38, 427/39, 118/729, 118/50.1, 118/620, 134/1
• US Class Current: 438/716
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32779 of batches of workpieces
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67706 Mechanical details, e.g. roller, belt H01L21/67709 takes precedence
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67751 vertical transfer of a single workpiece
• CPC Class Codes: H01L 21/6776 Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/0055 After-treatment, e.g. cleaning or desmearing of holes

Abstract

A method and apparatus are disclosed for continuous plasma etching of generally planar workpieces in which the workpieces are introduced into an evacuated chamber containing the plasma, are carried along a continuous processing path and are removed therefrom. The plasma is generated within the chamber and the workpieces are supported within an electrically neutral field within the processing plasma.

Claims

1. Apparatus for continuous plasma etching of generally planar workpieces, said apparatus comprising:

a substantially airtight enclosed processing chamber;

means for substantially evacuating said processing chamber;

means for introducing predetermined types and quantities of gases into said processing chamber;

means for introducing workpieces into said processing chamber while maintaining substantial evacuation of said processing chamber;

means for supporting and moving said workpieces along a predetermined path within said processing chamber;

means for generating within said processing chamber an electrically charged plasma such that said plasma substantially surrounds said workpieces while maintaining said workpieces within an electrically neutral field; and

means for removing workpieces from said processing chamber while maintaining substantial evacuation of said processing chamber.

2. The apparatus of claim 1 wherein said plasma generating means comprises means positioned adjacent said workpieces for generating said plasma adjacent said workpieces.

3. The apparatus of claim 2 wherein said plasma generating means comprises means positioned adjacent each said workpiece.

4. The apparatus of claim 3 wherein said plasma generating means comprises a ground electrode positioned adjacent each broad side of each said workpiece and a power electrode positioned adjacent but spaced from each said ground electrode with said ground electrode interposed between said power electrode and the respective said workpiece.

5. The apparatus of claim 4 wherein said electrodes are supported by said workpiece supporting and moving means, whereby the electrodes are carried along the same path with the workpieces.

6. The apparatus of claim 1 wherein said workpiece path comprises at least a portion of a continuous path followed by said supporting and moving means.

7. The apparatus of claim 1 wherein said workpiece introducing means comprises mean for sequentially introducing individual workpieces into said processing chamber from the ambient pressure exterior.

8. The apparatus of claim 7 wherein said workpiece introducing means comprises a chamber selectively communicating with said processing chamber and selectively communicating with said exterior to receive workpieces from outside the apparatus, whereby the introducing chamber may be selectively opened or closed to the processing chamber or to the exterior or to both.

9. The apparatus of claim 8 further comprising evacuating means connected to said introducing chamber for evacuating said introducing chamber after a workpiece has been introduced thereinto and before communication is opened between said introducing chamber and said processing chamber.

10. The apparatus of claim 8 wherein said introducing chamber further includes means for guiding a workpiece along a predetermined introducing path into said processing chamber.

11. The apparatus of claim 10 further comprising means for positioning said workpiece supporting and moving means in general alignment with said workpiece introducing path to receive an introduced said workpiece within said processing chamber.

12. The apparatus of claim 1 wherein said workpiece removing means comprises means for sequentially removing workpieces from said processing chamber to the ambient pressure exterior.

13. The apparatus of claim 12 wherein said workpiece removing means comprises means for releasing a workpiece from said workpiece supporting and moving means.

14. The apparatus of claim 12 wherein said workpiece removing means comprises a chamber selectively communicating with said processing chamber and selectively communicating with said exterior to receive workpieces from said processing chamber for delivery to said exterior, whereby the workpiece removing chamber may be selectively opened or closed to the processing chamber or to the exterior or to both.

15. The apparatus of claim 14 further comprising evacuating means connected to said workpiece removing chamber for evacuating said workpiece removing chamber before a workpiece is introduced thereinto from said processing chamber.

16. The apparatus of claim 14 wherein said workpiece removing chamber includes means for guiding the removal of a workpiece along a predetermined path from said processing chamber.

17. The apparatus of claim 16 further comprising means for positioning said workpiece supporting and moving means in general alignment with said workpiece removal path whereby the workpiece removing chamber may receive a removed said workpiece from said processing chamber.

18. The apparatus of claim 1 wherein said workpiece supporting and moving means comprises carrier means for supporting said introduced workpieces and drive means for urging said carrier means along said processing chamber path.

19. The apparatus of claim 18 wherein said drive means comprises means for stepwise movement of said carrier means along said processing chamber path.

20. The apparatus of claim 18 wherein said carrier means comprises a plurality of holders each holding a single workpiece and wherein said drive means further comprises means for maintaining said holders in predetermined relationships spaced from one another as said holders are moved along said processing chamber path.

21. The apparatus of claim 18 wherein said plasma generating means comprises electrodes attached to said carrier means.

22. The apparatus of claim 21 wherein said carrier means comprises a plurality of holders each holding a single workpiece and wherein said electrodes comprise at least one power electrode and at least one ground electrode attached to each said holder.

23. The apparatus of claim 22 wherein a ground electrode is positioned proximal each broad side of each said supported workpiece and a power electrode is positioned adjacent but spaced from each said ground electrode with said ground electrode interposed between said power electrode and the respective said workpiece.

24. The apparatus of claim 22 wherein said plasma generating means further comprises means for conducting radio-frequency energy to said power electrodes while said electrodes are moved along said processing chamber path.

25. A method of continuous plasma etching of workpieces within a processing chamber, comprising the steps of:

evacuating said processing chamber and maintaining said processing chamber at a predetermined low pressure;

introducing predetermined types and quantities of processing gases into said processing chamber;

introducing workpieces into said processing chamber while maintaining said processing chamber substantially at said predetermined low pressure;

supporting and moving said workpieces along a predetermined path within said processing chamber;

generating an electrically charged plasma within said processing chamber and surrounding said workpieces while maintaining said workpieces within an electrically neutral field; and

removing said workpieces from said processing chamber to an ambient pressure exterior location while maintaining the interior or said processing chamber substantially at said predetermined low pressure.

26. The method of claim 25 wherein said plasma is generated by applying radio-frequency energy to said gases at locations intermediate adjacent workpieces.

27. The method of claim 26 wherein said radio-frequency energy is so applied to said gases while said workpieces are being moved along said predetermined path.

28. The method of claim 26 wherein said workpieces are of generally planar configuration and are introduced sequentially into said processing chamber and are supported therewithin with the broad surfaces of said workpieces generally vertical.

29. The method of claim 28 wherein said plasma is generated by applying radio-frequency energy to electrodes positioned intermediate adjacent said workpieces and moving said electrodes along said processing chamber path with said workpieces.

30. The method of claim 29 wherein said workpieces are supported within said processing chamber intermediate pairs of ground electrode with said ground electrodes being interposed between said workpieces and power electrodes to which said radio-frequency energy is applied.

31. The method of claim 25 wherein said workpieces are introduced sequentially and individually from the ambient pressure exterior into said processing chamber, are moved in a stepwise continuous manner along said processing chamber path and are removed sequentially and individually from said processing chamber to the ambient pressure exterior.