Process for making rolled wafer cones

• US 4,624,855 A
• Filed: 04/25/1985
• Issued: 11/25/1986
• Est. Priority Date: 05/04/1984
• Status: Expired due to Term

• Current Assignee: Franz HAAS Waffelmaschinen IndustrieGmbH
• Original Assignee: Franz HAAS Waffelmaschinen IndustrieGmbH
• Inventors: Haas, Johann, Haas, Franz Jr., Haas, Franz Sr.
• Primary Examiner(s): YEUNG, GEORGE CHAN PUI
• Application Number:
  US06/727,006
• Time in Patent Office: 579 Days
• Field of Search: 426/501, 426/502, 426/503, 426/512, 426/514, 426/138
• US Class Current: 426/501
• CPC Class Codes: A21B 5/026 for baking waffle cups or cones
• CPC Class Codes: A21C 15/025 Apparatus for shaping or moulding baked wafers, e.g. to obtain cones for ice cream

Abstract

In a process of making a rolled wafer cone from a baked flat wafer blank made from a sugar-containing wafer dough, the baked wafer blank is rolled to form a wafer cone in a winding mold while the wafer blank is still in a soft, deformable state after the baking operation. Thereafter the rolled wafer cone is permitted to harden. In order to ensure the production of wafer cones having consistently exactly the same shape, it is proposed that the wafer cone which is unrestrained at least in part is shortened in the winding mold to a predetermined length while the wafer cone is adapted to be plastically deformed. For this purpose the rolled wafer cone disposed in the winding mold is subjected to a plastic deformation only at one end or only at both ends. The process can be carried out by means of winding devices, which are mounted on a rotary frame and each of which comprises a conical winding core, which is secured to a winding shaft that is displaceable relative to the rotary frame to move the conical winding into and out of the winding mold. In that apparatus each winding device is provided with at least one sizing device, which is associated with the rim of the wafer cone and comprises at least one pressure-applying finger, which is adapted to be introduced between the winding mold and the winding core.

Claims

1. A process for making a rolled wafer cone having an upper open, circular cone rim and a lower closed cone tip, comprising the steps of

(a) baking a sugar-containing wafer dough to form a flat wafer blank having a closed edge around the blank,

(b) delivering the baked flat wafer blank in a plastically deformable state to a winding mold,

(c) rolling the wafer blank in the plastically deformable state in the winding mold to form a wafer cone of a configuration determined by the winding mold while leaving the closed wafer blank edge unrestrained and a portion of the unrestrained closed wafer blank edge forms the upper cone rim,

(d) plastically deforming the formed upper cone rim until the plastic deformation produces a cone of an exactly defined, upper open circular cone rim and an exactly defined length between the cone rim and tip, and

(e) permitting the cone having the exactly defined upper rim and the exactly defined length to harden.

2. The process of claim 1, wherein the wafer blank continues to be rolled while the upper cone rim is plastically deformed.

3. The process of claim 1, wherein the upper cone rim is plastically deformed after the rolling of the wafer blank to form the cone of determined configuration has been discontinued and the formed cone stands still.

4. The process of claim 1, wherein a portion of the unrestrained closed wafer blank edge forms the lower cone tip after the wafer blank is rolled in the plastically deformable state in the winding mold to form the wafer cone of the configuration determined by the winding mold, and further comprising the step of plastically deforming the lower cone tip until the plastic deformation produces the cone of the exactly defined length between the cone rim and tip.

5. The process of claim 4, wherein the wafer blank continues to be rolled while the upper cone rim and the lower cone tip are plastically deformed.

6. The process of claim 4, wherein the upper cone rim and the lower cone tip are plastically deformed after the rolling of the wafer blank to form the cone of determined configuration has been discontinued and the formed cone stands still.