Surface acoustic wave device with impedance matching network formed thereon

• US 4,625,184 A
• Filed: 06/27/1983
• Issued: 11/25/1986
• Est. Priority Date: 07/02/1982
• Status: Expired due to Fees

• Current Assignee: Clarion Co., Ltd. (Faurecia SA)
• Original Assignee: Clarion Co., Ltd. (Faurecia SA)
• Inventors: Okamoto, Takeshi, Minagawa, Shoichi, Niitsuma, Teruo
• Primary Examiner(s): LaRoche, Eugene R.
• Assistant Examiner(s): LEE, BENNY T
• Application Number:
  US06/508,397
• Time in Patent Office: 1,247 Days
• Field of Search: 333/193, 333/194, 333/195, 333/150, 333/151, 333/152, 333/153, 333/154, 333/32, 310/313 R, 310/313 B, 310/313 C, 310/313 D
• US Class Current: 333/150
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H03H 9/02574 of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
• CPC Class Codes: H03H 9/0542 consisting of a lateral arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/14597 Matching SAW transducers to external electrical circuits

Abstract

The surface acoustic wave device comprises an elastic substrate, a piezoelectric film deposited on the elastic substrate, and transducers and matching circuits both provided on the piezoelectric film or along the interface between the piezoelectric film and the elastic substrate.

Claims

1. A surface acoustic wave device which comprises:

a piezoelectric substrate which includes a semiconductor substrate and a piezoelectric film deposited on said semiconductor substrate, said semiconductor substrate including means defining a low resistance zone along a surface thereof having said piezoelectric film thereon;

transducer means provided on said piezoelectric substrate;

at least one pair of rectangular patterns of conductive film provided on said piezoelectric film and connected to said transducer means, said rectangular patterns being aligned with said low resistance zone; and

strip lines of conductive film provided on said piezoelectric film and each having an end which is connected to a respective one of said rectangular patterns, said strip lines being aligned with said low resistance zone;

said piezoelectric substrate, said low resistance zone, said rectangular patterns and said strip lines serving as a matching circuit which matches the electrical admittance of said surface acoustic wave device with the electrical admittance of an external circuit to be connected to ends of said strip lines remote from said rectangular patterns.

2. The surface acoustic wave device according to claim 1, wherein said transducer means includes first, second and third spaced transducer electrodes provided on said piezoelectric film so that said second electrode is between said first and third transducer electrodes, one of said rectangular patterns being connected to said first and third transducer electrodes and the other of said rectangular patterns being connected to said second transducer electrode.

3. A surface acoustic wave device, comprising:

a piezoelectric substrate;

transducer means provided on said piezoelectric substrate;

first and second sections of conductive film which are generally rectangular, are provided on said piezoelectric substrate, and are electrically connected to said transducer means; and

first and second strip lines which are provided on said piezoelectric substrate and which each have an end connected to a respective one of said first and second sections of conductive film;

said piezoelectric substrate, said first and second sections and said strip lines serving as a matching circuit which matches the electrical admittance of said surface acoustic wave device to the electrical admittance of an external circuit to be connected to ends of said strip lines remote from said first and second sections of conductive film;

wherein said piezoelectric substrate includes a semiconductor substrate and a piezoelectric film deposited thereon, wherein said transducer means, said first and second sections of conductive film and said strip lines are provided on a side of said piezoelectric film remote from said semiconductor substrate, and wherein said semiconductor substrate includes means defining a low resistance zone adjacent said piezoelectric film and aligned with said strip lines and said first and second sections of conductive film.

4. The surface acoustic wave device according to claim 3, wherein each of said strip lines is made of a conductive film and is approximately serpentine-shaped.

5. The surface acoustic wave device according to claim 3, wherein each of said strip lines is made of a conductive film and is arranged in a spiral.

6. The surface acoustic wave device according to claim 3, wherein each of said strip lines is a bonding wire.

7. The surface acoustic wave device according to claim 3, including a magnetic film which partly covers at least one of said strip lines.

8. A surface acoustic wave device which comprises:

a piezoelectric substrate which includes a semiconductor substrate, an insulative film deposited on said semiconductor substrate, and a piezoelectric film deposited on said insulative film;

transducer means provided on said insulative film;

at least one pair of rectangular patterns of conductive film provided on said insulative film and connected to said transducer means; and

strip lines of conductive film provided on said insulative film and each having an end which is connected to a respective one of said rectangular patterns;

said substrate, said rectangular patterns and said strip lines serving as a matching circuit which matches the electrical admittance of said surface acoustic wave device with the electrical admittance of an external circuit to be connected to ends of said strip lines remote from said rectangular patterns, said semiconductor substrate including a low resistance zone along a surface thereof having said insulative film thereon.

9. A surface acoustic wave device, comprising:

a piezoelectric substrate;

transducer means provided on said piezoelectric substrate;

first and second sections of conductive film which are generally rectangular, are provided on said piezoelectric substrate, and are electrically connected to said transducer means; and

first and second strip lines which are provided on said piezoelectric substrate and which each have an end connected to a respective one of said first and second sections of conductive film;

said piezoelectric substrate, said first and second sections and said strip lines serving as a matching circuit which matches the electrical admittance of said surface acoustic wave device to the electrical admittance of an external circuit to be connected to ends of said strip lines remote from said first and second sections of conductive film;

wherein said piezoelectric substrate includes a semiconductor substrate, an insulative film, and a piezoelectric film, said insulative film being provided between said piezoelectric film and said semiconductor substrate, wherein said transducer means, said first and second sections of conductive film and said strip lines are provided on a side of said insulative film adjacent said piezoelectric film, and wherein said semiconductor substrate including means defining a low resistance zone which is adjacent said insulative film and aligned with said first and second sections of conductive film.

10. The surface acoustic wave device according to claim 9, including a magnetic film which partly covers at least one said strip line.