Device for programmable thick film networks

• US 4,626,818 A
• Filed: 11/28/1983
• Issued: 12/02/1986
• Est. Priority Date: 11/28/1983
• Status: Expired due to Fees

• Current Assignee: Centralab Incorporated 5855 N Glen Park Milwaukee WI A Corporation
• Original Assignee: Centralab Incorporated
• Inventors: Hilgers, John L.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Cabaniss, Jennifer E.
• Application Number:
  US06/555,847
• Time in Patent Office: 1,100 Days
• Field of Search: 264/61, 264/60, 29/832, 29/623, 337/142, 337/233, 337/290, 337/297, 337/66
• US Class Current: 337/166
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01L 23/5256 comprising fuses, i.e. connections having their state changed from conductive to non-conductive
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03F 2203/45522 the FBC comprising one or more potentiometers
• CPC Class Codes: H03F 3/45475 using IC blocks as the active amplifying circuit
• CPC Class Codes: H03G 1/0088 using discontinuously variable devices, e.g. switch-operated
• CPC Class Codes: H03H 7/24 Frequency- independent attenuators
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

An energy sensitive fusible device fabricated by thick film techniques in which a fuse element is sandwiched between two glazes on a substrate, for use in programming thick film networks.

Claims

1. A thick film fusible device for use in a programmable thick film network comprising:

an alumina substrate;

a layer of an inorganic dielectric glaze screened on said substrate;

a thick film conductor in the form of a pattern of a fusible link having a narrow segment deposited on and straddling said glazed substrate; and

a second layer of inorganic glaze deposited over said first layer of glaze and the narrow segment of said fusible link, said second layer confining said conductor pattern so that high current released to said fusible link will cause said second layer of glaze to rupture thus releasing the conductive material and resulting in a high post fusing resistance.