Connecting structure of terminal area of printed circuit board

• US 4,626,961 A
• Filed: 12/06/1984
• Issued: 12/02/1986
• Est. Priority Date: 12/10/1983
• Status: Expired due to Term

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Ono, Yasuichi, Nakamura, Moritoshi, Amagishi, Yoshitada
• Primary Examiner(s): Kucia, R. R.
• Application Number:
  US06/678,982
• Time in Patent Office: 726 Days
• Field of Search: 361/398, 361/411, 361/412, 361/414, 200/5 A
• US Class Current: 361/751
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0239 Coupling agent for particles using a coupling agent to improve the adhesion between an insulating substrate and a metal H05K3/389
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/125 Inorganic compounds, e.g. silver salt
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A printed circuit board has a terminal area to which the terminal area of a sheet member is electrically connected. The sheet member is bonded to the printed circuit board with a hot-melt adhesive. The layer of the hot-melt adhesive which is formed on the sheet member and does not face the terminal area of the printed circuit board protrudes from the surface of the terminal area of the sheet member. The printed circuit board includes an insulating substrate made from a material containing silicon dioxide. A metal salt that imparts hydrophobicity to the bonded surface of the substrate is added to the layer of the hot-melt adhesive.

Claims

1. A printed circuit board assembly comprising a printed circuit board having a first terminal area which is electrically connected to a sheet member having a second terminal area;

said first terminal area of said printed circuit board comprising a substrate having a plurality of spaced-apart first terminals formed thereon;

said second terminal area comprising a plurality of spaced-apart second terminals corresponding to said first terminals formed on said sheet member, said second terminals each including a first layer of an electrically conductive material and a second layer of an electrically conductive hot-melt adhesive, and the spaces around said second terminals having a layer of electrically insulating hot-melt adhesive formed to a thickness greater than the thickness of said second terminals such that the surface of said insulating layer protrudes above the surface of said second terminals; and

said first and second terminal areas being electrically connected and bonded together by said hot-melt adhesives, wherein said electrically conductive adhesive layer of said second terminals are bonded in registration with said first terminals, and said electrically insulating adhesive layer in the spaces around said second terminals being bonded to said substrate of said printed circuit board in the spaces around said first terminals.

2. A printed circuit board assembly as set forth in claim 1, wherein said substrate of said printed circuit board is made from an insulating material containing silicon dioxide, and wherein said electrically insulating adhesive layer of said sheet member contains a compound that imparts hydrophobicity to the surface of said substrate by chemically coupling with the oxygen of the silanol groups on the substrate surface.

3. A printed circuit board assembly as set forth in claim 2, wherein the compound that imparts hydrophobicity is a metal salt selected from the group consisting of nickel chloride and ammonium molybdate.

4. A printed circuit board assembly as set forth in claim 2, wherein the compound that imparts hydrophobicity is a coupling agent which contains silane.

5. A printed circuit board assembly as set forth in claim 2, wherein the compound that imparts hydrophobicity is an isocyanate compound.

6. A printed circuit board assembly as set forth in claim 2, wherein the compound that imparts hydrophobicity is a Lewis base.

7. A printed circuit board assembly as set forth in claim 1, wherein said first layer of electrically conductive material consists of a thin film of silver and a thin film of carbon formed on the silver film.

8. A printed circuit board assembly as set forth in claim 1, wherein said electrically insulating adhesive layer is formed on two sides around said second terminal area.

9. A printed circuit board assembly as set forth in claim 1, wherein an end of said second terminal area does not extend to an end of said sheet member, and said electrically insulating adhesive layer is formed between the ends of said second terminal area and said sheet member.

10. A printed circuit board assembly as set forth in claim 1, wherein said second terminal area of said sheet member is formed by a base film of polyester, said electrically insulating adhesive layer formed on said base film and made of a hot-melt adhesive that includes a chloroprene rubber and a high-molecular thermoplastic coupling agent of polyester, said first layer of electrically conductive material formed on said base film, said second layer of electrically conductive hot-melt adhesive formed on said first layer so as to extend around the sides of said first layer to said base film, and said second layer containing electrically conductive fine particles and a high-molecular thermoplastic coupling agent of polyester.

11. A printed circuit board assembly as set forth in claim 1, further comprising an electrically insulative and elastic protective film formed on a portion of said first and second terminal areas which is subject to flexing, said protective film being made of a rubber-like synthetic resin such as silicone elastomer.

12. A printed circuit board assembly as set forth in claim 11, wherein said protective film is formed as a continuous layer over the surface of said portion of said first and second terminal areas and extending to a portion of said printed circuit board beyond said first terminal area.