Thin card-type electronic apparatus
First Claim
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1. An electronic apparatus consisting essentially of:
- a substrate having a first wiring pattern on a first surface thereof, said first wiring pattern including first key contacts and first electrically conductive paths connected to said first key contacts;
at least one recess in said first surface of said substrate for receiving an electronic component;
at least one electronic component positioned within said at least one recess, said electronic component having electrical conductor leads;
a flexible layer having a second wiring pattern on a first surface thereof, said second wiring pattern comprising second key contacts and second electrically conductive paths connected to said second key contacts;
said flexible layer being positioned on said substrate such that said first surface of said flexible layer faces said first surface of said substrate and said first key contacts are aligned with said second key contacts and said flexible layer covers said at least one recess;
spacer means interposed between said substrate and said flexible layer at least adjacent said first and second key contacts to space said key contacts from each other; and
power supply means;
wherein said electrical conductor leads of said electronic component and said power supply means are each electrically engaged with at least one of said first and second electrically conductive paths of said first and second wiring patterns.
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Abstract
A thin electronic apparatus comprises as its primary structural components a substrate carrying key counter contacts and a first wiring pattern thereon, and an elastic sheet carrying key symbols on one surface thereof and a second wiring pattern on the other surface thereof. The thin electronic apparatus consists primarily of the substrate bonded to the elastic sheet and electronic components housed in cavities in the substrate.
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Citations
13 Claims
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1. An electronic apparatus consisting essentially of:
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a substrate having a first wiring pattern on a first surface thereof, said first wiring pattern including first key contacts and first electrically conductive paths connected to said first key contacts; at least one recess in said first surface of said substrate for receiving an electronic component; at least one electronic component positioned within said at least one recess, said electronic component having electrical conductor leads; a flexible layer having a second wiring pattern on a first surface thereof, said second wiring pattern comprising second key contacts and second electrically conductive paths connected to said second key contacts; said flexible layer being positioned on said substrate such that said first surface of said flexible layer faces said first surface of said substrate and said first key contacts are aligned with said second key contacts and said flexible layer covers said at least one recess; spacer means interposed between said substrate and said flexible layer at least adjacent said first and second key contacts to space said key contacts from each other; and power supply means; wherein said electrical conductor leads of said electronic component and said power supply means are each electrically engaged with at least one of said first and second electrically conductive paths of said first and second wiring patterns. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification