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High density packaging technique for electronic systems

  • US 4,631,636 A
  • Filed: 03/26/1984
  • Issued: 12/23/1986
  • Est. Priority Date: 03/26/1984
  • Status: Expired due to Term
First Claim
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1. A high density packaging arrangement for electronics systems, comprising:

  • a first circuit board assembly, comprising an insulating circuit board having a plurality of electronic components mounted on a first side thereof and having conductor means interconnecting said electronic components, and having cooling means, mounted on a second side thereof, for passage of a coolant; and

    a second circuit board assembly, comprising an insulating circuit board having cooling means, mounted on a second side thereof, for passage of a coolant;

    wherein said first and second circuit board assemblies are arranged such that said cooling means mounted on said second circuit board assembly is in heat conductive contact with at least one of said plurality of electronic components mounted on said first circuit board assembly.

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