High density packaging technique for electronic systems
First Claim
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1. A high density packaging arrangement for electronics systems, comprising:
- a first circuit board assembly, comprising an insulating circuit board having a plurality of electronic components mounted on a first side thereof and having conductor means interconnecting said electronic components, and having cooling means, mounted on a second side thereof, for passage of a coolant; and
a second circuit board assembly, comprising an insulating circuit board having cooling means, mounted on a second side thereof, for passage of a coolant;
wherein said first and second circuit board assemblies are arranged such that said cooling means mounted on said second circuit board assembly is in heat conductive contact with at least one of said plurality of electronic components mounted on said first circuit board assembly.
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Abstract
A high density packaging arrangement for electronics systems wherein a plurality of circuit board assemblies are provided with electronic components on one side and cooling tubes on the other side. The assemblies are arranged such that the cooling tubes mounted on one board cool the electronic components mounted on an adjacent board. Electronic contact elements are provided on the circuit board surfaces, to allow electrical interconnection of the electronic components mounted on adjacent boards.
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Citations
26 Claims
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1. A high density packaging arrangement for electronics systems, comprising:
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a first circuit board assembly, comprising an insulating circuit board having a plurality of electronic components mounted on a first side thereof and having conductor means interconnecting said electronic components, and having cooling means, mounted on a second side thereof, for passage of a coolant; and a second circuit board assembly, comprising an insulating circuit board having cooling means, mounted on a second side thereof, for passage of a coolant; wherein said first and second circuit board assemblies are arranged such that said cooling means mounted on said second circuit board assembly is in heat conductive contact with at least one of said plurality of electronic components mounted on said first circuit board assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A high density packaging arrangement for electronics systems, comprising:
a plurality of circuit board assemblies, each circuit board assembly comprising; an insulating circuit board having a plurality of recesses formed on a first side thereof, and having a plurality of channels formed on a second side thereof; a plurality of electronics components mounted in said recesses; conductor means electrically interconnecting said electronic components; and cooling means, mounted in said channels, for passage of a coolant; wherein a first and a second of said plurality of circuit board assemblies are arranged such that said cooling means of said second circuit board assembly is in heat conductive contact with at least one of said plurality of electronic components mounted in said recesses on said first side of said first circuit board assembly. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A high density packaging arrangement for electronic systems, comprising:
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a first circuit board assembly, comprising an insulating circuit board having a plurality of electronic components mounted on a first side thereof and having conductor means interconnecting said electronic components; and a second circuit board assembly, comprising an insulating circuit board having a plurality of electronic components mounted on a first side thereof and having conductor means interconnecting said electronic components and having cooling means, mounted on a second side thereof, for passage of a coolant; wherein said first and second circuit board assemblies are arranged such that said cooling means mounted on said second circuit board assembly is in heat conductive contact with at least one of said plurality of electronic components mounted on said first circuit board assembly.
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Specification