CVD temperature control

• US 4,632,056 A
• Filed: 08/05/1985
• Issued: 12/30/1986
• Est. Priority Date: 08/05/1985
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Spectrum CVD Incorporated Phoenix AZ
• Inventors: Price, J. B., Stitz, Robert W.
• Primary Examiner(s): Bueker, Richard
• Application Number:
  US06/762,240
• Time in Patent Office: 512 Days
• Field of Search: 118/664, 118/666, 118/725, 118/712
• US Class Current: 118/712
• CPC Class Codes: C23C 16/42 Silicides
• CPC Class Codes: C23C 16/5096 Flat-bed apparatus
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence

Abstract

Chemical vapor deposition on a semiconductor wafer is obtained in a plasma reactor having a plurality of lamps for radiantly heating the wafer. Calibrated temperature sensing means remote from the wafer is used to control the heating of the wafer. Gases are supplied by way of a plurality of tubes extending radially inwardly from the sides of the chamber. A baffle is provided to form an antechamber which aids in the uniformity of the deposition. The plasma is ignited for less than the whole deposition cycle for deposition of tungsten disilicide.

Claims

1. A chemical vapor deposition apparatus comprising:

means for enclosing a volume, said means including a thermally translucent window;

heating means adjacent the outside of said window for radiantly heating an article within said volume;

temperature sensing means within said heating means for detecting the amount of heat produced by said heating means.

2. Apparatus as set forth in claim 1 wherein said temperature sensing means comprises a predetermined mass for simulating the effect of said heating means on said article.

3. Apparatus as set forth in claim 1 wherein said temperature sensing means comprises

a thermocouple junction device;

and

a disk of predetermined mass in thermal contact with said device.

4. Apparatus as set forth in claim 3 wherein said temperature sensing means is positioned away from said window within said heating means.

5. Apparatus as set forth in claim 4 and further comprising:

pin means for supporting said disk and for thermally isolating said disk within said heating means.

6. Apparatus as set forth in claim 5 wherein said disk comprises recesses for receiving said pin means.

7. Apparatus as set forth in claim 4 and further comprising:

means for cooling said disk.

8. Apparatus as set forth in claim 7 wherein said disk is thin relative to its diameter.