Primer composition

• US 4,634,602 A
• Filed: 01/02/1986
• Issued: 01/06/1987
• Est. Priority Date: 01/02/1986
• Status: Expired due to Fees

• Current Assignee: PPG Industries Incorporated (Nouryon BV)
• Original Assignee: PPG Industries Incorporated (Nouryon BV)
• Inventors: Niederst, Kenneth W., Sirkoch, Robert J.
• Primary Examiner(s): Page, Thurman K.
• Application Number:
  US06/815,698
• Time in Patent Office: 369 Days
• Field of Search: 427/44, 427/54.1, 427/386, 427/407.1, 427/410, 522/94, 522/6
• US Class Current: 427/507
• CPC Class Codes: C08F 283/00 Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
• CPC Class Codes: C09D 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00

Abstract

Compositions of the invention comprise a radiation sensitive compound having ethylenic unsaturation and at least one moiety selected from the group consisting of a urea moiety, a urethane moiety and mixtures thereof, a radiation insensitive compound having a number average molecular weight of at least about 400 comprising at least about 40 percent, by weight, based on the weight of the radiation insensitive compound, of aromatic ring moieties and having a hydroxyl equivalent weight of between about 200 and 1500 and a crosslinking agent reactive with the hydroxyl groups present in said radiation insensitive compound, said crosslinking agent being selected from the group consisting of an aminoplast resin, a blocked isocyanate and mixtures thereof. The composition is capable of being cured using heat and either ultraviolet light or ionizing radiation. A process for applying and curing the composition of the invention on a substrate is also disclosed.

Claims

1. A composition comprising:

(a) a radiation sensitive compound having ethylenic unsaturation and at least one moiety selected from the group consisting of a urea moiety, a urethane moiety and mixtures thereof;

(b) a radiation insensitive compound having a number average molecular weight of at least about 400, comprising at least about 40 percent, by weight, based on the weight of said radiation insensitive compound, of aromatic ring moieties and having a hydroxyl group equivalent weight of between about 200 and about 1500; and

(c) a crosslinking agent reactive with the hydroxyl groups present in said radiation insensitive compound, said crosslinking agent being selected from the group consisting of an aminoplast resin, a blocked isocyanate and mixtures thereof,

such that said composition is capable of being cured using heat and either ultraviolet light or ionizing radiation.

2. The composition of claim 1 wherein said radiation sensitive compound comprises a urethane moiety.

3. The composition of claim 1 wherein said radiation sensitive compound comprises acrylate functionality.

4. The composition of claim 2 wherein said radiation sensitive compound is a urethane acrylate.

5. The composition of claim 4 wherein said urethane acrylate is a diacrylate.

6. The composition of claim 1 wherein said radiation insensitive compound is an epoxy resin.

7. The composition of claim 1 wherein said crosslinking agent is an aminoplast resin selected from the group consisting of a melamine resin, a benzoguanamine resin and mixtures thereof.

8. The composition of claim 1 wherein said radiation sensitive compound is present at a level of from about 5 percent to about 50 percent, by weight, based on resin solids.

9. The composition of claim 1 wherein said radiation insensitive compound is present at a level of from about 15 percent to about 60 percent, by weight, based on resin solid.

10. The composition of claim 1 wherein said aminoplast resin is present at a level of from about 3 percent to about 10 percent, by weight, based on resin solids.

11. The composition of claim 1 further comprising a reactive diluent.

12. A process comprising the steps of:

(a) applying to a substrate a composition comprising

(i) a radiation sensitive compound having ethylenic unsaturation and at least one moiety selected from the group consisting of a urea moiety, a urethane moiety and mixtures thereof,

(ii) a radiation insensitive compound having a number average molecular weight of at least about 400, comprising at least about 40 percent, by weight, based on the weight of said radiation insensitive compound, of aromatic ring moieties and having a hydroxyl group equivalent weight of between about 200 and 1500, and

(iii) a crosslinking agent reactive with the hydroxyl groups present in said radiation insensitive compound, said crosslinking agent being selected from the group consisting of an aminoplast resin, a blocked isocyanate and mixtures thereof, such that said composition is capable of being cured using heat and either ionizing radiation or ultraviolet light.

(b) partially curing said composition in a first curing step; and

(c) further curing said composition in a second curing step;

wherein one of said curing steps comprises exposing said coated substrate to either ultraviolet light or ionizing radiation and the other curing step comprises exposing said coated substrate to heat.

13. The process of claim 12 further comprising the step of applying a topcoat to said coated substrate between said first and second curing steps.

14. The process of claim 12 wherein said first curing step involves exposing said coated substrate to either ultraviolet light or ionizing radiation.

15. The process of claim 13 wherein said topcoat is thermally curable, said first curing step involves exposing said coated substrate to either ultraviolet light or ionizing radiation and said second step involves exposing said coated substrate to heat.

16. The process of claim 12 wherein said composition is applied to said substrate so that it is cured to a dry film thickness of from about 1 mil to about 3 mils.

17. The process of claim 12 wherein said substrate is metal.