Miniaturized electric contact assembly for microswitch
First Claim
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1. A contact assembly for a microswitch, comprising:
- a base material having a hole formed therein; and
a contact material inserted into and calked in the hole in the shape of a rivet, wherein said base material comprises a copper alloy having iron phosphide crystallized therein, having an electrical conductivity of 96-97 (% IACS), having a heat transfer rate of not less than 1.0 (cal/cm, sec, °
C.) at a temperature of approximately 20°
C. and having a chemical composition of 0.025 to 0.040% by weight of phosphorus, 0.05 to 0.15% by weight of iron and the remainder copper.
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Abstract
A contact assembly for a microswitch has a contact material inserted into and calked in a hole formed in a base material which is a copper alloy having iron phosphide crystallized therein and having a chemical composition of 0.025 to 0.040% by weight of phosphorus, 0.05 to 0.15% by weight of iron and the rest of copper.
44 Citations
4 Claims
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1. A contact assembly for a microswitch, comprising:
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a base material having a hole formed therein; and a contact material inserted into and calked in the hole in the shape of a rivet, wherein said base material comprises a copper alloy having iron phosphide crystallized therein, having an electrical conductivity of 96-97 (% IACS), having a heat transfer rate of not less than 1.0 (cal/cm, sec, °
C.) at a temperature of approximately 20°
C. and having a chemical composition of 0.025 to 0.040% by weight of phosphorus, 0.05 to 0.15% by weight of iron and the remainder copper. - View Dependent Claims (2, 3, 4)
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Specification