Package for optical element

• US 4,636,647 A
• Filed: 05/15/1984
• Issued: 01/13/1987
• Est. Priority Date: 05/31/1983
• Status: Expired due to Term

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Nishizawa, Hideaki
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Gatto, James G.
• Application Number:
  US06/610,414
• Time in Patent Office: 973 Days
• Field of Search: 250/551, 250/578, 250/239, 250/211 R, 250/211 J, 358/212, 358/213, 357/30, 357/31, 357/32, 357/24, 357/19
• US Class Current: 250/551
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4248 Feed-through connections for the hermetical passage of fibres through a package wall see provisionally also G02B6/4428
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12033 Gunn diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/483 Containers

Abstract

A package for an optical element which receives or emits light thereinto or therefrom and is bonded on a substrate is disclosed. The substrate is a transparent one. An electrode pad including a window therein is formed on the top of the substrate and the optical element is bonded on the top of the electrode pad. By this structure, light is received into or emitted from the optical element through the transparent substrate and the window formed in the electrode pad.

Claims

1. A package for an optical element which receives or emits light, comprising:

a transparent sapphire glass substrate;

a first ceramic peripheral member being bonded on top of the substrate;

an electrode pad including a window formed therein on top of the substrate and extending across the first peripheral member; and

a second ceramic ring-shaped peripheral member overlapping with and bonded on top of said first peripheral member so as to surround the optical element;

wherein said optical element is bonded on top of the electrode pad and is extended over the window of the electrode pad;

whereby light is received into and emitted from the optical element through the transparent substrate and the window of the electrode pad.

2. The package for an optical element as set forth in claim 1, in which said electrode pad is a metallic layer formed by photolithography.

3. The package for an optical element as set forth in claim 1, further comprising:

a cap welded to said second peripheral member to seal the package.