General technique for the integration of MIC/MMIC'S with waveguides

• US 4,636,753 A
• Filed: 05/15/1984
• Issued: 01/13/1987
• Est. Priority Date: 05/15/1984
• Status: Expired due to Fees

• Current Assignee: COMSAT Corporation (Reorganized ISA SA)
• Original Assignee: Communications Satellite Corporation (Reorganized ISA SA)
• Inventors: Zaghloul, Amir I., Geller, Bernard D.
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US06/610,537
• Time in Patent Office: 973 Days
• Field of Search: 333/21 R, 333/26, 333/238, 333/246, 333/248, 455/327, 455/328
• US Class Current: 333/26
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions

Abstract

A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.

Claims

1. A microwave transition device for coupling a waveguide and a microwave integrated circuit, said transition device being located within said waveguide for alignment with an electric field having microwave energy, said device comprising:

a dielectric substrate having a metallized surface on only one side thereof;

a unilateral finline formed in said metallized surface at an end portion of said substrate;

a slotline formed adjacent to said finline on said metallized surface and connected to said finline at one end thereof; and

a balun positioned proximate to said slotline, said microwave integrated circuit being attached to said metallized surface and connected to said balun, wherein said balun comprises a portion of said slotline equal in length to 1/4 of the wavelength of the electric field and a wire bond, passing over said portion of said slotline, and connected at one end to said microwave integrated circuit and at an opposite end to said metallized surface.

2. The device of claim 1 wherein said microwave integrated circuit is an MMIC.

3. The device of claim 1 wherein the finline is realized with an inwardly converging, sinsuoidally tapering configuration.

4. The device of claim 1 wherein the finline is realized with an inwardly converging, exponentially tapering configuration.

5. The device of claim 1 wherein the finline is realized with a stepped, quarter-wavelength configuration.

6. The device of claim 1 wherein said device supports only a single polarization.

7. The device of claim 1 wherein said balun further comprises a coplanar waveguide positioned on a side opposite of said slotline from said microwave integrated circuit said wire bond connecting said coplanar waveguide to said microwave circuit.

8. The device of claim 7 wherein said slotline is in the configuration of a semicircle and said portion of said slotline forms 1/2 of said semicircle extending from a midway point of said slotline to a short-circuited end of said slotline opposite to an open-circuited end connected to said finline.

9. The device of claim 7 wherein said device supports only a single polarization.

10. The device of claim 1 wherein said balun further comprises a coplanar waveguide intersecting said slotline.

11. The device of claim 10 further comprising air bridges for connecting surfaces of said metallized surface on either side of said coplanar waveguide to form continuous wall edges of said slotline intersected by said coplanar waveguide.

12. The device of claim 1 wherein said substrate is a ceramic material.

13. The device of claim 12 wherein said ceramic material is beryllia.

14. The device of claim 12 wherein said ceramic material is alumina.