Data carrier with an IC module and a method for producing such a data carrier
First Claim
1. A data carrier with an IC module for processing electrical signals, in which the IC module is disposed in the interior of the data carrier and connected via leads to contact surfaces arranged in the vicinity of the IC module, communication taking place with peripheral units via these contact surfaces, characterized in that a first area of the data carrier in which the IC module, the leads and the contact surfaces are provided is connected with a second, remaining area of the data carrier by one or more predetermined breaking points arranged along a line separating the two areas and which reduce transmission of bending stresses from one area of the card to the other.
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Accused Products
Abstract
The integrated circuit embedded in a data carrier and the contact surfaces connected with this circuit are to be protected against bending of the data carrier. For this purpose, the data carrier is divided into two areas, the first one, which bears the circuit and is generally small compared to the second area, being connected to the second area via a predetermined breaking point. Stress which occurs when the data carrier is bent is kept away from the circuit, or transmitted only weakly to it, by the predetermined breaking point.
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Citations
13 Claims
- 1. A data carrier with an IC module for processing electrical signals, in which the IC module is disposed in the interior of the data carrier and connected via leads to contact surfaces arranged in the vicinity of the IC module, communication taking place with peripheral units via these contact surfaces, characterized in that a first area of the data carrier in which the IC module, the leads and the contact surfaces are provided is connected with a second, remaining area of the data carrier by one or more predetermined breaking points arranged along a line separating the two areas and which reduce transmission of bending stresses from one area of the card to the other.
- 9. A method for producing a data carrier with an IC module for processing electrical signals, in which the IC module is disposed in the interior of the data carrier and connected via leads to contact surfaces arranged in the vicinity of the IC module, exhibiting a first area of the data carrier in which the IC module, the leads and the contact surfaces are provided is connected with a second, remaining area of the data carrier by one or more predetermined breaking points arranged along a line separating the two areas and which reduce transmission of bending stresses from one area of the card to the other comprising the steps of reducing the cross-section of the data carrier to produce the predetermined breaking points after laminating the data carrier, which may consist of several layers.
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12. A method for producing a data carrier in which an IC module and contact surfaces connected thereto via leads are connected to an at least three-layer data carrier card, characterized by the following steps:
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preparing two card cover layers and at least one card core layer, applying one or more recesses in the card core layers, in areas of the subsequent predetermined breaking points, laminating the various card layers, the IC module being connected with the card layers. - View Dependent Claims (13)
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Specification