Method of bonding copper and resin

• US 4,642,161 A
• Filed: 01/27/1986
• Issued: 02/10/1987
• Est. Priority Date: 01/31/1985
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kogawa, Kiyonori, Akahoshi, Haruo, Shimazaki, Takeshi, Murakami, Kanji, Wajima, Motoyo, Toba, Ritsuji
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/823,003
• Time in Patent Office: 379 Days
• Field of Search: 427/96-98, 427/399, 156/630, 156/634, 156/656, 156/659.1, 156/666, 156/902, 156/307.7, 156/314, 156/317
• US Class Current: 216/35
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2305/076 Prepregs
• CPC Class Codes: B32B 38/004 by physically contacting the layers, e.g. by the use of heated platens or rollers
• CPC Class Codes: C23C 18/40 using reducing agents
• CPC Class Codes: C23C 22/63 Treatment of copper or alloys based thereon
• CPC Class Codes: C23C 22/83 Chemical after-treatment
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 3/385 by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

Claims

1. A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.

2. A method of bonding copper and a resin together as claimed in claim 1, wherein said reducing solution is an aqueous solution containing at least one amine borane represented by the general formula:

BH₃.NHRR'"'"' (wherein R and R'"'"' are each a member selected from the group consisting of H, CH₃, and CH₂ CH₃)

3. A method of bonding copper and a resin together as claimed in claim 2, wherein said bonding is effected by heat-pressing said surface of said metallic copper formed by said reduction and said resin.

4. A method of bonding copper and a resin together as claimed in claim 3, wherein said resin is a member selected from the group consisting of polyimide resins, polyamide resins, epoxy resins, polyester resins, phenolic resins, polyethylene resins, polyphenylene sulfide resins, polyether-imide resins, and fluororesins.

5. A method of bonding copper and a resin together as claimed in claim 3, wherein said copper is immersed in an aqueous neutral or alkaline solution containing an oxidizing agent to form said copper oxide layer on the surface of copper.

6. A method of bonding copper and a resin together as claimed in claim 5, wherein said oxidizing agent is a chlorite or a persulfate.

7. A method of bonding copper and a resin together comprising the step (i) of forming copper oxide layers on the surfaces of copper foils of a plurarity of copper clad laminates, the step (ii) of reducing said copper oxide layers to metallic copper with a reducing solution, and the step (iii) of heat-pressing an assembly of said copper clad laminates subjected to the step (ii) which are piled up with a prepreg(s) therebetween impregnated with a resin for contact of the surfaces of said metallic copper with said resin of said prepreg(s) to effect bonding of said metallic copper and said resin of said prepreg(s).

8. A method of bonding copper and a resin together as claimed in claim 7, wherein said copper foils have predetermined patterns formed.

9. A method of bonding copper and a resin together as claimed in claim 8, wherein said reducing solution is an aqueous solution containing at least one amine borane represented by the general formula:

BH₃.NHRR'"'"' (wherein R and R'"'"' are each a member selected from the group consisting of H, CH₃, and CH₂ CH₃)

10. A method of bonding copper and a resin together as claimed in claim 9, wherein said resin is a member selected from the group consisting of polyimide resins, polyamide resins, epoxy resins, polyester resins, phenolic resins, polyethylene resins, polyphenylene sulfide resins, polyetherimide resins, and fluororesins.

11. A method of bonding copper and a resin together as claimed in claim 9, wherein said surface of copper foils are immersed in an aqueous neutral or alkaline solution containing an oxidizing agent to form said copper oxide layers on said surfaces of copper foils.