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Method of bonding copper and resin

  • US 4,642,161 A
  • Filed: 01/27/1986
  • Issued: 02/10/1987
  • Est. Priority Date: 01/31/1985
  • Status: Expired due to Term
First Claim
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1. A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.

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