Method of bonding copper and resin
First Claim
1. A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.
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Accused Products
Abstract
A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.
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Citations
11 Claims
- 1. A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.
- 7. A method of bonding copper and a resin together comprising the step (i) of forming copper oxide layers on the surfaces of copper foils of a plurarity of copper clad laminates, the step (ii) of reducing said copper oxide layers to metallic copper with a reducing solution, and the step (iii) of heat-pressing an assembly of said copper clad laminates subjected to the step (ii) which are piled up with a prepreg(s) therebetween impregnated with a resin for contact of the surfaces of said metallic copper with said resin of said prepreg(s) to effect bonding of said metallic copper and said resin of said prepreg(s).
Specification