Electronic control of an automatic wafer inspection system

• US 4,644,172 A
• Filed: 02/22/1984
• Issued: 02/17/1987
• Est. Priority Date: 02/22/1984
• Status: Expired due to Term

• Current Assignee: KLA Instruments, Corporation
• Original Assignee: KLA Instruments, Corporation
• Inventors: Cutler, Gerald R., Levy, Kenneth, Hodgson, Michael L., Singleton, Russell M., Sandland, Paul
• Primary Examiner(s): Nelms, David C.
• Assistant Examiner(s): Oen, William
• Application Number:
  US06/582,583
• Time in Patent Office: 1,091 Days
• Field of Search: 250/548, 250/557, 250/561, 356/400, 356/401, 358/106, 364/507
• US Class Current: 250/548
• CPC Class Codes: G01N 2021/8867 using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
• CPC Class Codes: G01N 21/8851 Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system for automatic micro and macro inspection of patterned wafers, including a X-Y stage for supporting and positioning a wafer at a macro inspection station and a micro inspection station, a plurality of cassettes for storing a plurality of patterned wafers before and after inspection, a transfer arm and apparatus for transferring a wafer from the cassettes to a predetermined location on the X-Y stage, apparatus for centering the wafer on the macro inspection station, apparatus for aligning the wafer to obtain a preselected orientation for macro inspection, an optical system for effecting macro inspection of the wafer and storing a unique image thereof, apparatus for moving the wafer from the macro inspection station to the micro inspection station so that the area of the wafer corresponding to the stored unique image is in a micro optical path, autofocus apparatus for automatically focusing the lowest magnification objective lens on the area of the wafer to derive a real time image, a comparitor for comparing the stored unique image to the real time image, apparatus responsive to the comparison of the stored unique image and the real time image and operative to more precisely position the wafer in the micro optical path, apparatus for using areas of the wafer displaced one from the other to obtain more precise alignment of the wafer, apparatus for performing a pre-established micro inspection of selected areas of the wafer and apparatus for returning the wafer to a storage cassette.

Claims

1. A system for automatic micro and macro inspection of patterned wafers, comprising:

X-Y stage means for supporting wafer at a macro inspection station and a micro inspection station;

means for storing a plurality of patterned wafers before and after inspection;

means for transferring a wafer from said storing means to a predetermined location on said X-Y stage means;

means for centering said wafer in said macro inspection station;

means for aligning said wafer to obtain a preselected orientation for macro inspection;

means for effecting macro inspection of said wafer;

means for grabbing a unique image following macro inspection and storing said unique image;

means for moving said wafer to said micro inspection station so that the area of said wafer correspondence to said stored unique image is in a micro optical path;

means for automatically focusing the lowest magnification objective lens on said area of said wafer to derive a real time image;

means for comparing said stored unique image to said real time image;

means responsive to the comparison of said stored unique image and said real time image and operative to more precisely position said wafer in said micro optical path;

means for using areas of said wafer, displaced one from the other, to obtain a more precise alignment;

means for performing a preestablished micro inspection on selected areas of said wafer; and

means for transporting said wafer to said storage means.

2. A system as set forth in claim 1 wherein said means for centering comprises:

means for illuminating said wafer;

means for processing the reflected light which is adjacent the periphery of the wafer to obtain a summation of the pixels around the circumference; and

means moving said wafer on said stage to a portion wherein a minimum sum is obtained, whereby said wafer will be centered.

3. A system set forth in claim 2 wherein said means for aligning comprises:

means for aligning the wafer flat in accordance with the users selected orientation;

means for moving the stage to a reference area of such as a dropout in the wafer pattern;

means for comparing the dropout image with a reference; and

means for moving the stage means so as to align the dropout image with said reference.

4. A system as set forth in claim 3 wherein said means for effecting a macro inspection comprises:

moving the stage to a center position in each of four quandrants;

means for selecting a pair of images at each quadrant;

means for comparing the selected images to determine if they are alike or different; and

means for determining if the differences, if any, are within or without tolerance for the wafer inspection.

5. A system as set forth in claim 4 wherein said means for grabbing a unique image comprises:

means for moving the wafer so that the unique image is centered in the field of view;

means for moving the highest magnification macro lens into the macro optical path; and

means for storing said unqiue image.

6. A system as set forth in claim 5 wherein said means for moving to said micro inspection station comprises:

an objective lens turret including a plurality of different magnification objective lenses on said turret;

means for moving said turret up and down vertically;

control means for ensuring said turret is in its uppermost position; and

means for transporting said wafer from the macro inspection station to the micro inspection station.

7. Apparatus as set forth in claim 6 wherein said means for automatically focusing comprises:

means for rotating said turret to bring the lowest magnification objective lens into said micro optical path;

means for illuminating said micro optical path with a reticle pattern;

means responsive to said reticle pattern characteristics for focusing said objective lens; and

means for comparing the stored image with the real time image from the wafer aligned with said stored image.

8. Apparatus as set forth in claim 7 wherein said means for using areas of said wafer comprises:

means for moving said stage to a position near the right edge of said wafer;

means for grabbing an image at said right edge;

means for storing said right edge image;

means for moving said stage to a position near the left edge of said wafer;

means for grabbing an image at said left edge;

means for comparing said right and left images; and

means for moving said stage to bring said right and left images into alignment.