Mounting device for a thick layer electronic module
First Claim
1. A device for mounting at least one heat generating component on a heat sink, said device comprising an electrically insulating support having a first face on which is disposed the heat generating component and means for clamping the insulating support against a bearing face of the heat sink, wherein said heat generating component consists in a thick layer component deposited on the first face of said support, and said first face is situated in the mounted position on the heat sink side, whereas the thick layer of said component is separated from the heat sink by a heat conducting electrially insulating device having a predetermined flexibility for accomodting the imperfections of said thick layer.
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Accused Products
Abstract
A device is provided for mounting a thick layer component, more especially for an electronic module. Said component comprises a thick layer deposited on a face of an electrically insulating support. This face is, in the mounted position, on the same side as a heat sink, whereas the thick layer is separated from the heat sink by an electrically insulating and heat conducting device of a given flexibility which accommodates the imperfections of the thick layer.
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Citations
15 Claims
- 1. A device for mounting at least one heat generating component on a heat sink, said device comprising an electrically insulating support having a first face on which is disposed the heat generating component and means for clamping the insulating support against a bearing face of the heat sink, wherein said heat generating component consists in a thick layer component deposited on the first face of said support, and said first face is situated in the mounted position on the heat sink side, whereas the thick layer of said component is separated from the heat sink by a heat conducting electrially insulating device having a predetermined flexibility for accomodting the imperfections of said thick layer.
- 14. In an electronic module comprising a printed circuit card, at least one thick layer component implanted on the card perpendicularly thereto, a heat sink and a device for mounting the component on the heat sink before soldering of the component to the card, said mounting device comprising an electrically insulating support having a first face on which is disposed the thick layer component and means for clamping the insulating support against a bearing face of the heat sink, wherein said first face is situated in the mounted position on the heat sink side, whereas the thick layer of said component is separated from the heat sink by a heat conducting electrically insulating device having a predetermined flexibility for accomodating the imperfections of said thick layer.
Specification