Mounting device for a thick layer electronic module

• US 4,648,008 A
• Filed: 07/03/1985
• Issued: 03/03/1987
• Est. Priority Date: 07/06/1984
• Status: Expired due to Fees

• Current Assignee: Telemecanique Electrique
• Original Assignee: La Telemecanique Electrique
• Inventors: Neyroud, Jean, Guillier, Alain, Mahi, Abdelkader
• Primary Examiner(s): Rimrodt, Louis K.
• Application Number:
  US06/751,641
• Time in Patent Office: 608 Days
• Field of Search: 361/386, 361/387, 361/388, 357/80, 357/81
• US Class Current: 361/706
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device is provided for mounting a thick layer component, more especially for an electronic module. Said component comprises a thick layer deposited on a face of an electrically insulating support. This face is, in the mounted position, on the same side as a heat sink, whereas the thick layer is separated from the heat sink by an electrically insulating and heat conducting device of a given flexibility which accommodates the imperfections of the thick layer.

Claims

1. A device for mounting at least one heat generating component on a heat sink, said device comprising an electrically insulating support having a first face on which is disposed the heat generating component and means for clamping the insulating support against a bearing face of the heat sink, wherein said heat generating component consists in a thick layer component deposited on the first face of said support, and said first face is situated in the mounted position on the heat sink side, whereas the thick layer of said component is separated from the heat sink by a heat conducting electrially insulating device having a predetermined flexibility for accomodting the imperfections of said thick layer.

2. The mounting device as claimed in claim 1, wherein said electrically insulating device comprises an electric insulating foil made from a flexible material such as a thermosilicon, disposed directly on said thick layer.

3. The mounting device as claimed in claim 1, wherein a biasable screen is inserted between said thick layer and the heat sink for reducing the coupling capacity between the thick layer and the heat sink, said screen being connected to an appropriate potential for this purpose.

4. The mounting device as claimed in claim 3, wherein the biasable screen is formed by a second thin electrically insulating foil inserted between the first insulating foil and said heat sink, said second foil being provided on the first foil side with an electrically conducting coating connected to the appropriate potential.

5. The mounting device as claimed in claim 3, wherein said biasable screen is fixed to said first insulating foil by means of an adhesive so as to form an insulating sub-assembly more flexible on the thick layer side than on the heat sink side.

6. The mounting device as claimed in claim 1, wherein a stiffening wafer is associated with the component, said stiffening wafer being fixed to a second face of the support opposite the first face of said support.

7. The mounting device as claimed in claim 6, wherein said stiffening wafer forms a heat diffusion means contributing to avoiding hot spots on the component.

8. The mounting device as claimed in claim 6, wherein said component and said semiconductor component chip carriers are removably fixed to the heat sink by means of identical resilient clips, said stiffening wafer forming a shim for adapting the thickness "e" of the clamping zone of the component to the thickness of the clamping zone of the chip carriers.

9. The mounting device as claimed in claim 8, wherein said biasable screen has a zone bent back against the stiffening wafer associated with the component and aganst the semi conductor component chip carriers requiring high insulation with respect to the heat sink and to the clips.

10. The mounting device as claimed in claim 1, wherein semiconductor component chip carriers are mounted on the same heat sink.

11. The mounting device as claimed in claim 10, wherein the area of the electrically conducting coating of the biasable screen corresponds substantially to that of the components and of the semiconductor component chip carriers to be decoupled capacitively.

12. The mounting device as claimed in claim 1, wherein said thick layer component has one or more resistors, said means for clamping the component on the heat sink being formed by one or more clamping clips.

13. The mounting device as claimed in claim 1, wherein the thick layer of the component is connected to a card by means of a cable harness.

14. In an electronic module comprising a printed circuit card, at least one thick layer component implanted on the card perpendicularly thereto, a heat sink and a device for mounting the component on the heat sink before soldering of the component to the card, said mounting device comprising an electrically insulating support having a first face on which is disposed the thick layer component and means for clamping the insulating support against a bearing face of the heat sink, wherein said first face is situated in the mounted position on the heat sink side, whereas the thick layer of said component is separated from the heat sink by a heat conducting electrically insulating device having a predetermined flexibility for accomodating the imperfections of said thick layer.

15. The electronic module as claimed in claim 14, wherein said heat sink is fixed to a main heat sink forming part of the mechanical structure of a casing of the electronic module receiving the card.