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Visible/infrared imaging device with stacked cell structure

  • US 4,651,001 A
  • Filed: 12/13/1984
  • Issued: 03/17/1987
  • Est. Priority Date: 12/19/1983
  • Status: Expired due to Term
First Claim
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1. A solid-state image sensing device comprising:

  • a semiconductive substrate having a cell region;

    a first photosensing section, which is formed on said substrate and within the cell region thereof, said second section comprising means for generating a first charge packet or signal charge by sensing an infrared image light component contained in input light;

    a second photosensing section, which is stacked over said first photosensing section to be included in the cell region of said substrate, said second section comprising means for generating a second charge packet or signal charge by sensing a visible image light component which is contained in the input light; and

    readout means connected to said first and second photosensing sections, for reading out the first and second signal charges, said readout means comprising,a transfer channel layer which is formed in said substrate, said transfer channel layer comprising means to transfer the first and second signal charges, anda gate electrode layer which is formed over said transfer channel section and partially overlap with said first and second photosensing sections, said gate electrode layer comprising means for receiving a pulse signal and for shifting the first and second signal charges into said transfer channel section in response to the pulse signal.

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