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Apparatus for breaking semiconductor wafers and the like

  • US 4,653,680 A
  • Filed: 04/25/1985
  • Issued: 03/31/1987
  • Est. Priority Date: 04/25/1985
  • Status: Expired due to Term
First Claim
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1. Apparatus for breaking a segment of relatively hard sheet material along a plurality of parallel and spaced-apart break lines, said apparatus comprising:

  • support means for supporting the segment at least prior to breaking, said support means including a relatively rigid support element and a relatively non-rigid support element;

    breaker means for imparting a shock to the segment which is distributed along a first one of the break lines so as to fracture the segment along the first break line, said breaker means including a breaker bar having a knife-edge which imparts said shock through said non-rigid support element along substantially the entire length of the break lines;

    anvil means for restricting displacement of the segment when said shock is imparted to the segment; and

    drive means for causing said breaker means to fracture the segment along a second one the break lines, adjacent the first break line.

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