Apparatus for breaking semiconductor wafers and the like

• US 4,653,680 A
• Filed: 04/25/1985
• Issued: 03/31/1987
• Est. Priority Date: 04/25/1985
• Status: Expired due to Term

• Current Assignee: Dynatex
• Original Assignee: Barrie F. Regan
• Inventors: Regan, Barrie F.
• Primary Examiner(s): YOST, FRANK
• Application Number:
  US06/727,277
• Time in Patent Office: 705 Days
• Field of Search: 225/2, 225/96.5, 225/104, 225/103, 125/23 R, 125/30 R, 125/35
• US Class Current: 225/104
• CPC Class Codes: B26F 3/002 Precutting and tensioning or breaking
• CPC Class Codes: B28D 5/0017 using moving tools
• CPC Class Codes: B28D 5/0052 Means for supporting or holding work during breaking means for conveying work to or discharging work from the breaking machine B28D5/0058
• CPC Class Codes: B28D 5/0058 Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material B28D5/0005, B28D5/024 take precedence
• CPC Class Codes: Y10T 225/371 Movable breaking tool
• CPC Class Codes: Y10T 225/379 Breaking tool intermediate spaced work supports

Abstract

Apparatus and method for breaking a scribed semiconductor wafer and the like. The apparatus includes a wafer support which is movable with respect to a breaker arm having a knife-edge. The breaker arm is actuated pneumatically or by other similar means to impart a shock or impulse to the wafer along each of the wafer scribe lines so as to fracture the wafer. A control mechanism is provided for automatically alternately stepping the wafer position with respect to the breaker arm and actuating the breaker arm. Once the entire wafer has been broken along one axis, the wafer is rotated ninety degrees and the sequence is repeated along the other axis.

Claims

1. Apparatus for breaking a segment of relatively hard sheet material along a plurality of parallel and spaced-apart break lines, said apparatus comprising:

support means for supporting the segment at least prior to breaking, said support means including a relatively rigid support element and a relatively non-rigid support element;

breaker means for imparting a shock to the segment which is distributed along a first one of the break lines so as to fracture the segment along the first break line, said breaker means including a breaker bar having a knife-edge which imparts said shock through said non-rigid support element along substantially the entire length of the break lines;

anvil means for restricting displacement of the segment when said shock is imparted to the segment; and

drive means for causing said breaker means to fracture the segment along a second one the break lines, adjacent the first break line.

2. The apparatus of claim 1 wherein said non-rigid element is in the form of a film.

3. The apparatus of claim 2 wherein said film includes a segment-mounting area for mounting the segment and said rigid support element supports said film at locations displaced from said segment mounting area.

4. The apparatus of claim 3 wherein said rigid support means supports said film along substantially the entire periphery of said film.

5. The apparatus of claim 4 wherein said film includes an adhesive layer for securing the segment.

6. The apparatus of claim 5 wherein said anvil means includes an anvil member and said film is disposed between said breaker bar and said anvil member.

7. The apparatus of claim 6 wherein said anvil member includes a resilient pad for contacting the segment.

8. The apparatus of claim 7 wherein said anvil member is movable between a first position disposed proximate said segment mounting area and a second position displaced from said first position.

9. Apparatus for breaking a segment of relatively hard sheet material along a plurality of parallel and spaced-apart break lines, said apparatus comprising:

support means for supporting the segment, said support means including a relatively rigid support element and a relatively non-rigid support element;

breaker means for applying an impulse to the segment along a first one of the break lines so as to fracture the segment along the first break line, said breaker means including a breaker bar having a knife-edge which applies said impulse to the segment through said non-rigid support element;

anvil means for limiting movement of the segment; and

drive means for causing said breaker means to fracture the segment along each of the break lines, wherein said drive means includes stepper means for sequentially steppping the relative positions of the segment and said breaker bar such that said knife-edge is disposed opposite each of the break lines and actuating means for actuating said breaker means so as to cause said breaker bar to apply said impulse to the segment through said non-rigid support element, with said drive means automatically alternating between said stepping and said actuating.

10. The apparatus of claim 9 wherein said non-rigid support element is in the form of a film having a segment-mounting area for mounting the segment, with the film being supported by said rigid support element at locations displaced from said segment-mounting area.

11. The apparatus of claim 10 wherein said anvil means includes an anvil member, with said segment-mounting area being disposed between said anvil member and said breaker bar.

12. The apparatus of claim 11 wherein said rigid support means supports said film along substantially the entire periphery of said film.

13. The apparatus of claim 12 wherein said film includes an adhesive layer for securing the segment.

14. The apparatus of claim 13 wherein said anvil means includes an anvil member and said film is disposed between said breaker bar and said anvil member.

15. The apparatus of claim 14 wherein said anvil member includes a resilient pad for contacting the segment.

16. The apparatus of claim 15 wherein said anvil member is movable between a first position disposed proximate said segment mounting area and a second position displaced from said first position.

17. Apparatus for breaking a semiconductor wafer along a plurality of wafer scribe lines comprising:

support means for supporting the wafer, said support means including a relatively rigid support element and a relatively non-rigid support element;

breaker means for imparting a shock to the wafer along a first one of the wafer scribe lines through said relatively non-rigid support element so as to fracture the wafer along the first scribe line, said breaker means including a breaker bar having a knife-edge; and

drive means for causing said breaker means to sequentially fracture the wafer along successive wafer scribed lines, with said drive means including stepper means for sequentially steeping the relative positions of the wafer and said breaker bar such that said knife-edge is disposed opposite each of the scribe lines and actuating means for actuating said breaker means thereby causing said breaker bar to impart said shock to the wafer.

18. The apparatus of claim 17 wherein said non-rigid element is in the form of a film.

19. The apparatus of claim 18 wherein said film includes a wafer mounting area for mounting the wafer and said rigid support element supports said film at locations displaced from said wafer mounting area.

20. The apparatus of claim 19 wherein said rigid support means supports said film along substantially the entire periphery of said film.

21. The appartus of claim 20 wherein said film includes an adhesive layer for securing the wafer.

22. The apparatus of claim 21 wherein said anvil means includes an anvil member and said film is disposed between said breaker bar and said anvil member.

23. The apparatus of claim 22 wherein said anvil member includes a resilient pad for contacting the wafer.

24. The apparatus of claim 23 wherein said anvil member is movable between a first position disposed proximate said wafer mounting area and a second position displaced from said first position.