Electronic component box supplied with a capacitor

• US 4,654,694 A
• Filed: 07/26/1984
• Issued: 03/31/1987
• Est. Priority Date: 07/29/1983
• Status: Expired due to Term

• Current Assignee: Compagnie D'Informatique Militaire Spatiale et Aeronautique
• Original Assignee: Compagnie D'Informatique Militaire Spatiale et Aeronautique
• Inventors: Val, Christian
• Primary Examiner(s): Davie, James W.
• Application Number:
  US06/634,433
• Time in Patent Office: 978 Days
• Field of Search: 174/52 FP, 357/51, 357/74, 357/75, 357/84, 361/401, 361/406, 361/408, 361/380, 361/392, 361/395, 361/399, 361/403, 361/321, 361/321 C
• US Class Current: 257/665
• CPC Class Codes: H01L 2224/45184 Tungsten (W) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An electronic box having a capacitor in the form of a supporting plate bearing a component and covered by a cap. Additionally, the box includes a capacitor connected onto the supporting plate in such a way as to be situated between the component and the cap.

Claims

1. An electronic component box comprising:

an electronic component;

a base bearing said component;

a cover fixedly sealed on said base;

a multilayer capacitor, positioned in said box between said component and said cover wherein said capacitor is supported on said base; and

at least three pads for connecting said multilayer capacitor to said base wherein said pads are positioned so that currents are able to flow in opposite directions in adjacent ones of said at least three pads.

2. A box according to claim 1, wherein said multilayer capacitor includes at least two superimposed separate capacitors connected to ground and respectively to at least two distinct voltages V₁, V₂.

3. A box according to claim 1, wherein said multilayer capacitor has a plurality of armatures and wherein each of the capacitor armatures present a flat pin terminal extending to the periphery of the capacitor so that terminals of the armature are electrically linked one above the other.

4. A box according to claim 1, wherein said box has a plurality of terminals in which said terminals are linked through a plurality of metallized holes.

5. A box according to claim 1, wherein said base includes at least one plate and three concentric rings placed one above the other on the plate and around said component with an increasing internal diameter, wherein the connections of said component are connected to first conductor tracks carried by a first one of said three rings, the connections of said capacitor being connected to second conductive tracks carried by a second one of said three rings, the first or second tracks passing outside the box, connection means crossing said second ring in order to link the first and second conductor tracks, said cover being fixed onto a third one of said rings.

6. A box according to claim 1, in which the electrical connections are placed in the periphery of the said capacitor.

7. The box according to claim 1 wherein said electronic component is an Integrated Circuit (IC).