Thermal link

• US 4,654,754 A
• Filed: 11/02/1982
• Issued: 03/31/1987
• Est. Priority Date: 11/02/1982
• Status: Expired due to Fees

• Current Assignee: Fairchild Weston Systems Inc.
• Original Assignee: Fairchild Weston Systems Inc.
• Inventors: Daszkowski, Joseph M.
• Primary Examiner(s): Pellinen, A. D.
• Assistant Examiner(s): Thompson, Gregory D.
• Application Number:
  US06/438,560
• Time in Patent Office: 1,610 Days
• Field of Search: 174/16 HS, 361/386, 361/389, 361/387, 361/388, 357/81, 357/79, 165/185, 165/80 B, 339/112 R, 200/85 R, 200/86 R
• US Class Current: 361/708
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20454 with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Abstract

A thermal link provides a thermal path between a heat source and a heat sink which compensates for irregularities on the surface of the heat source and/or heat sink and/or nonuniformity in the spacing therebetween. One embodiment utilizes a spring metal device having a free arm which allows the link to align itself under low pressure so that it is in intimate contact with both the heat source and heat sink. Another embodiment utilizes an elastomeric material filled with thermally conducting particles to form a mat that has a plurality of raised sections having air spaces between each of the sections. The raised areas deform under low pressure by expanding laterally into the air spaces to conform to the space between the heat source and the heat sink.

Claims

1. A thermal link which thermally connects a heat source and a heat sink, said heat source and heat sink having irregular surfaces or being nonuniformly spaced relative to each other, said thermal link comprising:

an electrically insulative mat of resiliently deformable material filled with thermally conductive particles, said mat having a plurality of integrally formed, raised sections with an air space therebetween, said air space allowing for lateral expansion of said plurality of raised sections when said elastomeric material is deformed under pressure applied to said thermal link by said heat sink and said heat source to conform to the space between said heat source and said heat sink.

2. The thermal link of claim 1 wherein said raised sections each comprise a hemisphere.

3. The thermal link of claim 1 wherein said raised sections each comprise an elongated strip.

4. The thermal link of claim 1, 2 or 3 wherein said mat beneath said raised sections contains a metal mesh.

5. The thermal link of claim 1 wherein said air space and raised sections are dimensioned so that when said raised sections are fully deformed under pressure applied to said thermal link by said heat sink and said heat source, the lateral expansion of said raised sections substantially fully fills said air space.

8. The thermal link of claim 1, 6, or 7, wherein said raised sections of said elastomeric material are substantially solid.

6. A thermal link which thermally connects a heat source and a heat sink, said heat source and heat sink having irregular surfaces or being nonuniformly spaced relative to each other, said thermal link comprising:

an electrically insulative mat of resiliently deformable elastomeric material filled with thermally conductive particles, said mat having a plurality of raised sections with an air space therebetween, said air space allowing for lateral expansion of said plurality of raised sections when said elastomeric material is deformed under pressure applied to said thermal link by said heat sink and said heat source to conform to the space between said heat source and said heat sink;

said air space and raised sections being dimensioned so that when said raised sections are fully deformed under pressure applied to said thermal link by said heat sink and said heat source, the lateral expansion of said raised sections substantially fully fills said air space.

7. A thermal link thermally connecting a heat source and heat sink, said heat source and heat sink having irregular surfaces or being nonuniformly spaced relative to each other, said thermal link comprising:

a mat of resiliently deformable elastomeric material filled with thermally conductive particles, said mat having a plurality of raised sections with an air space therebetween, said plurality of raised sections being expanded into said air space when said elastomeric material is deformed under pressure applied to said thermal link by said heat sink and said heat source to conform to the space between said heat source and said heat sink;

said mat beneath said raised sections containing a metal mesh.