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Automated single slice powered load lock plasma reactor

  • US 4,657,620 A
  • Filed: 10/22/1984
  • Issued: 04/14/1987
  • Est. Priority Date: 10/22/1984
  • Status: Expired due to Term
First Claim
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1. An apparatus for the manufacturing of semiconductor devices from semiconductor wafers having a plurality of semiconductor circuit patterns on at least a first surface of the semiconductor wafer, the apparatus comprises:

  • first means for providing a stream of reacting gases to react with the semiconductor wafer to create circuit elements according to the semiconductor circuit pattern thereby;

    second means for handling the wafers and includes a third means for bringing the wafers into contact with the reacting gas, fourth means for prereacting with a second group of reactant gases of the semiconductor wafers, fifth means for preventing the contamination of the third means and to provide a port for the transfer of the semiconductor wafers from the fourth means to the third means;

    sixth means for isolating the semiconductor wafers and the circuit elements from the third means and to perform a post reactant with a third group of reactant gases, seventh means for providing a port for the transfer of the semiconductor wafer between the third means and the sixth means, and eighth means for transferring the semiconductor wafer from the fourth means to the third means and from the third means to the sixth;

    means andninth means for controlling the operation of the apparatus.

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