Flexible flat multiconductor cable

• US 4,659,872 A
• Filed: 04/30/1985
• Issued: 04/21/1987
• Est. Priority Date: 04/30/1985
• Status: Expired due to Fees

• Current Assignee: AMP Incorporated (Johnson Controls International plc)
• Original Assignee: AMP Incorporated (Johnson Controls International plc)
• Inventors: May, Clifton C. Jr., Gentry, William G., Jones, Warren C., Dery, Ronald A., Wentink, Steven G.
• Primary Examiner(s): Grimley, A. T.
• Assistant Examiner(s): NIMMO, MORRIS
• Application Number:
  US06/728,956
• Time in Patent Office: 721 Days
• Field of Search: 174/72 C, 174/117 FF, 174/117 A, 174/117 PC
• US Class Current: 174/117.00A
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2201/09436 Pads or lands on permanent coating which covers the other conductors
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
• CPC Class Codes: H05K 3/247 Finish coating of conductors by using conductive pastes, inks or powders
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A flat multiconductor cable having a multilayer construction and especially suited for use in establishing interconnections between the cable conductors and a separate conductive array such as a similar flat cable is disclosed. Conductive ink, formed metal conductors or etched conductors can be deposited on a flexible substrate and covered by a dielectric covering in the form of an ultraviolet cured dielectric coating or a separate insulating film. The conductors can be covered by anisotropic conductive adhesive with the conductive adhesive in contact with the underlying conductors at exposed tap locations where no dielectric coating is deposited or where the dielectric coating has been removed. A separate conductive array can be positioned in registry with the tap locations and the conductive adhesive can be used both to secure the conductive array to the cable and to establish electrical continuity between corresponding conductors.

Claims

1. A multiconductor flat cable comprising a flexible insulating substrate;

a plurality of conductors disposed thereon, the conductors comprising a conductive ink comprising a solidified polymer having conductive material dispersed therein; and

a dielectric coating overlying the conductors, the dielectric coating comprising a flexible solidified dielectric ink, the conductive ink solidified polymer and the solidified dielectric ink each being curable from a solvated state in which the conductive ink and dielectric coating were screen printable.

2. The cable of claim 1 wherein the dielectric coating adheres to the insulating substrate between the conductors.

3. The cable of claim 2 wherein the dielectric ink comprises a solidified polymer curable from a solvated state by radiation.

4. The cable of claim 3 wherein the dielectric ink comprises a solidified photopolymer curable from a solvated state by the application of ultraviolet light.

5. The cable of claim 3 wherein the dielectric ink comprises a solidified photopolymer curable from a solvated state by the application of electron beam radiation.

6. The cable of claim 3 wherein the conductive ink comprises a conductive material containing a resin vehicle.

7. The cable of claim 6 wherein the conductive ink comprises a conductive material containing a polyester resin vehicle.

8. The cable of claim 6 the conductive ink is solidified upon the application of heat.

9. The cable of claim 1 wherein the flexible insulating substrate is formed from a material selected from the group including a polyester film a polyimide film and a polycarbonate film.

10. The cable of claim 1 wherein the dielectric coating is selectively discontinuous, being disposed over portions only of the conductors, other portions of the conductors being thereby exposed, the cable further comprising a layer of conductive adhesive disposed over the exposed conductors.

11. The cable of claim 10 wherein the conductive adhesive is flexible.

12. The cable of claim 10 wherein the conductive adhesive includes a thermoplastic resin.

13. The cable of claim 10 wherein the conductive adhesive comprises an anisotropic conductive adhesive.

14. The cable of claim 1 wherein the dielectric ink is thermally curable.

15. A multiconductor cable adapted to form a tap connection with corresponding conductors in a separate conductor array, comprising:

a flexible insulating substrate;

a plurality of conductors disposed thereon;

a dielectric coating overlying the conductors, the dielectric coating being selectively discontinuous and being disposed over portions only of the conductors, other portions of the conductors comprising exposed tap locations;

a conductive ink pad comprising a solidified polymer having a conductive material disposed therein overlying the conductor at at least one tap location; and

a conductive adhesive disposed over the exposed tap locations, whereby corresponding conductors disposed in registry with the tap locations can be interconnected to the conductors in the cable by the conductive adhesive.

16. The cable of claim 15 wherein a conductive ink is located at each tap location, the conductive ink comprising a solidified polymer having conductive material disposed therein, the conductive adhesive being disposed over the conductive ink.

17. The cable of claim 15 wherein the conductors comprise conductive ink comprising a solidified polymer having conductive material disposed therein.

18. The cable of claim 15 wherein the conductors comprise copper conductors affixed to the flexible substrate.

19. The cable of claim 18 wherein the conductors comprise copper conductors affixed to the flexible substrate, the cable further comprising solder disposed between the conductors and the conductive ink pad at each tap location.

20. The cable of claim 19 wherein the dielectric coating comprises a flexible film.

21. The cable of claim 20 wherein the tap locations are defined by laser cuts through the flexible film to expose the conductive traces.

22. The cable of claim 15 wherein at least two of the conductors are laterally adjacent, the first laterally adjacent conductor extending through a tap location, the second laterally adjacent conductor being covered by the dielectric coating adjacent the tap location, a conductive ink pad at the tap location extending laterally beyond the conductor extending through the tap location.

23. The cable of claim 22 wherein a portion of the conductive ink at each tap location overlaps the dielectric coating.

24. A multiconductor cable adapted to form a tap connection with corresponding conductors in a separate conductor array, comprising:

a flexible insulating substrate;

a plurality of conductors disposed thereon;

a dielectric coating overlying the conductors, the dielectric coating being selectively discontinuous and being disposed over portions only of the conductors, other portions of the conductors comprising exposed tap locations; and

a conductive adhesive disposed over the exposed tap locations, whereby corresponding conductors disposed in registry with the tap locations can be interconnected to the conductors in the cable by the conductive adhesive, the conductors, the dielectric coating and the conductive adhesive comprising solidified polymers cured from a solvated state in which the conductive ink, dielectric coating and conductive adhesive were screen printable.