Chip mounting device

• US 4,664,309 A
• Filed: 06/30/1983
• Issued: 05/12/1987
• Est. Priority Date: 06/30/1983
• Status: Expired due to Term

• Current Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Raychem Limited (TE Connectivity Limited)
• Inventors: Diaz, Stephen H., Allen, Leslie J., Cherian, Gabe
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/509,684
• Time in Patent Office: 1,412 Days
• Field of Search: 29/589, 228/56, 228/170, 228/173 R, 228/180.2, 228/248, 228/175, 228/249, 339/17 M, 339/17 CF, 339/DIG. 3
• US Class Current: 228/180.22
• CPC Class Codes: B23K 3/06 Solder feeding devices; Solder melting pans
• CPC Class Codes: B23K 35/0222 for use in soldering, brazing B23K35/0205 takes precedence
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 13/0465 by soldering H05K13/0469 takes precedence
• CPC Class Codes: H05K 2201/0215 Metallic fillers
• CPC Class Codes: H05K 2201/0314 Elastomeric connector or conductor, e.g. rubber with metallic filler elastomeric dielectric H05K2201/0133
• CPC Class Codes: H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/1028 Thin metal strips as connectors or conductors
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/10946 Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 2203/0415 Small preforms other than balls, e.g. discs, cylinders or pillars
• CPC Class Codes: H05K 2203/0769 Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.

Claims

1. A device for providing joint-forming material for forming a connection between two, vertically-spaced electrically-conductive elements, comprising:

a retaining member which comprises a layer of heat-recoverable material and which has apertures therein; and

preforms of joint-forming material disposed in the apertures, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectional dimension.

2. A device as in claim 1, wherein the preform is of a slender column configuration.

3. A device as in claim 1, wherein the preform is of an elongatd arcuate configuration.

4. A device as in claim 1, wherein the preform is of a coiled spring configuration.

5. A device as in claim 1, wherein the preform is of solder material.

6. An apparatus as in claim 1, wherein the retaining member comprises a protruding portion disposed on one or more surfaces of the layer.

7. An apparatus as in claim 6, wherein an adhesive layer is disposed on a surface of the protruding portion.

8. An apparatus for providing a plurality of discrete quantities of preformed colulmns of joint-forming material for forming connections between sets of vertically-spaced electrically-conductive elements of an electrical device, each set of conductive elements distributed in a pattern, comprising:

a dissolvable retaining member having a pattern of apertures homologous with the patterns of conductive elements;

preforms having a slender column configuration and comprising solder material disposed in the apertures, the preforms having a predefined elongated configuration with a height dimension greater than its transverse cross-sectonal dimension; and

wherein the preforms extend sufficiently from the surfaces of the retaining member whereby the preforms contact the conductive elements and the retaining member does not contact the conductive elements or the electrical device.

9. An apparatus as in claim 8, wherein the preforms comprise solder material having discrete particles of a material different from the solder disposed within the solder.

10. An apparatus as in claim 9, wherein the discrete particles are aligned with the elongated dimension of the preform.

11. An apparatus as in claim 8, wherein the preforms are of an elongated arcuate configuration.

12. An apparatus as in claim 8, wherein the retaining member comprises a plurality of elements bundled together, each having at least one aperture therethrough for the performs.

13. A method for simultaneously forming a resilient connection between each electrically-conductive element of a first pattern of such elements and each electrically-conductive element of a second pattern of such elements, said first and second patterns of elements being homologous and vertically spaced, comprising:

providing a preform of connection-forming material between each of said elements on the first and the second patterns of elements such that each preform is associated with an element of the first pattern and the homologous element of the second pattern, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectonal dimension;

effecting a bond between each preform and the set of conductive elements associated with the preform, each preform maintaining its predefined configuration during the bonding; and

wherein the providing of the preforms is effected by positioning a retaining member which comprises a layer of heat-recoverable material between the first and the second patterns of conductive elements, the retaining member having a plurality of apertures distributed in a pattern homologous with the pattern of conductive elements, with the preforms being disposed within the apertures.

14. A method as in claim 13, wherein each preform is of a slender column configuration.

15. A method as in claim 14, wherein each preform is of solder material.

16. A method as in claim 13, wherein each preform is of an elongated arcuate configuration.

17. A method as in claim 13, wherein discrete particles of material different from the preform material are disposed within the preform and are aligned with the elongated dimension of the preform.

18. A method as in claim 13, wherein discrete continuous elements of material different from the preform material are disposed within the preform, along the elongated dimension of the preform.

19. A method as in claim 13, wherein the retaining member is a layer having a protruding portion disposed on one or more surfaces of the layer.

20. A method as in claim 19, wherein an adhesive layer is disposed on the surface of the protruding portion, the adhesive layer contacting the support for the patterns of conductive elements.

21. A method as in claim 20, further comprising applying heat to effect the bonding and to cause the protruding portions to recover toward the surfaces of the retaining member to draw the patterns of conductive elements toward the preforms.

22. A method as in claim 13, wherein the retaining member is removed after formation of the connections.

23. A method as in claim 13, wherein the retaining member is of compessible or surface-deformable material.

24. A method as in claim 13, wherein the preforms in the retaining element have different predefined configurations.

25. A method for providing a resilient connection on each electrically-conductive element of a pattern of such elements, comprising:

providing a preform of connection-forming material in contact with each of said elements on the pattern of elements, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectional dimension;

effecting a bond between each preform and each conductive elements associated with the preform, each preform maintaining its predefined configuration during the bond; and

wherein the providing of the preforms is effected by positioning a retaining member which comprises a layer of heat-recoverable material in position relative to the pattern of conductive elments, the retaining member having a plurality of apertures distributed in a patter homologous with the patterns of conductive elements, with the preforms being disposed within the apertures.

26. A method as in claim 25, wherein each preform is of a slender column configuration.

27. A method as in claim 25, wherein each preform is of solder material.

28. A method as in claim 25, wherein each preform is of an elongated arcuate configuration.

29. A method as in claim 25, wherein discrete particles of material different from the preform material are disposed within the preform and are aligned with the elongated dimension of the preform.

30. A method as in claim 25, wherein discrete continuous elements of material different from the preform material are disposed within the preform, along the elongated dimension of the preform.

31. A method as in claim 25, wherein the retaining member is a layer having a protruding portion disposed on one or more surfaces of the layer.

32. A method as in claim 31, wherein an adhesive layer is disposed on the surface of the protruding portion, the adhesive layer contacting the support for the patterns of conductive elements.

33. A method as in claim 31, further comprising applying heat to effect the bonding and to cause the protruding portions to recover toward the surfaces of the retaining member to draw the patterns of conductive elements toward the preforms.

34. A method as in claim 25, wherein the retaining member is removed after formation of the connections.

35. A method as in claim 25, wherein the retaining member is of compressible or surface-deformable material.

36. A method as in claim 25, wherein the preforms in the retaining element have different predefined configurations.

37. A method for providing a resilient connection on each electrically-conductive element of a pattern of such elements of an electrical device, comprising:

providing a preform having a slender configuration and comprising solder material in contact with each of said elements on the pattern of elements, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectional dimension;

effecting a bond between each preform and each conductive elements associated with the preform, each preform maintaining its predefined configuration during the bonding; and

wherein the providing of the preforms is effected by positioning a retaining member which is dissolvable in position relative to the pattern of conductive elements, the retaining member having a plurality of apertures distributed in a pattern homoglous with the patterns of conductive elements, with the preforms being disposed within the apertures and extending from the surfaces of the retaining member whereby the preforms contact the conductive elements and the retaining member does not contact the conductive elements or the electrical device.

38. A method as in claim 37, wherein each preform is of a column configuration.

39. A method as in claim 37, wherein each preform is of an elongated arcuate configuration.

40. A method as in claim 37, wherein discrete particles of material different from the preform material are disposed within the preform and are aligned with the elongated dimension of the preform.

41. A method as in claim 37, wherein discrete continuous elements of material different from the preform material are disposed within the preform, along the elongated dimension of the preform.

42. A method as in claim 37, further comprising applying heat to effect the bonding.

43. A method as in claim 37, wherein the retaining member is removed after formation of the connections.

44. A method as in claim 37, wherein the retaining member is of compressible or surface-deformable material.

45. A method as in claim 37, the preforms in the retaining element have different predefined configurations.