Process for producing product having patterned metal layer

• US 4,666,735 A
• Filed: 10/30/1985
• Issued: 05/19/1987
• Est. Priority Date: 04/15/1983
• Status: Expired due to Fees

• Current Assignee: Polyonics, Inc.
• Original Assignee: Polyonics, Inc.
• Inventors: Vandebult, Jan, Hoover, Merwin F., Salamone, Ann B.
• Primary Examiner(s): Newsome, John H.
• Application Number:
  US06/792,879
• Time in Patent Office: 566 Days
• Field of Search: 427/43.1, 427/44, 427/54.1, 427/98, 430/315, 430/414, 430/417
• US Class Current: 427/510
• CPC Class Codes: H01L 21/702 of thick-or thin-film circuits or parts thereof
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/09563 Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387

Abstract

A multilayered composite product useful as an electrical circuit is produced by coating a base with a photoimagable resin free of catalyst or catalyst activator for electroless metal deposition. The resin is patterned by exposure to a desired light, through a mask followed by development. The patterned cured resin is selectively chemically modified while avoiding chemical modification of the base to render the cured resin receptive to a metal catalyst. The metal catalyst which promotes subsequent electroless metal deposition is selectively absorbed on the patterned cured resin and is converted to a catalytically active form. A conductive metal then is deposited selectively on the catalyst-containing patterned cured resin.

Claims

1. The process for forming a composite product which comprises applying to a base a layer of a photosensitive resin, exposing said resin to actinic light in a pattern to form a solvatable resin and a patterned nonsolvatable resin, removing solvatable resin by contacting said solvatable resin with a solvent for the solvatable resin, chemically modifying said patterned resin to render the surface of said resin receptive to a catalyst capable of promoting electroless metal deposition without chemically modifying said base, contacting said chemically modified patterned resin with a catalyst composition capable of promoting electroless metal deposition, thereby to absorb said catalyst on said patterned layer, rinsing said patterned resin and said base to remove excess loose catalyst therefrom, converting said absorbed metal catalyst to an electrolytically active form capable of causing electroless metal deposition and electrolessly depositing a metal layer on said patterned resin selectively without effecting electroless deposition of said metal layer on said base.

2. The process of claim 1 wherein said base is a flexible substrate.

3. The process of claim 1 wherein said base is a rigid substrate.

4. The process of claim 1 wherein said metal layer is copper.

5. The process of claim 1 wherein said metal layer is nickel.

6. The process of claim 1 wherein the resin is chemically modified with aqueous alkali.

7. The process of claim 1 wherein the resin is chemically modified with quaternary ammonium hydroxide.

8. The process of claim 1 wherein the resin is chemically modified with aqueous acids.

9. The process of claim 1 wherein said photosensitive resin is cured when exposed to said actinic light.

10. The process of claim 1 wherein said photosensitive resin is rendered more solvatable in a solvent when exposed to said actinic light.

11. The process of claim 1 wherein said photosensitive resin is rendered less solvatable in a solvent when exposed to said actinic light.

12. The process of claim 1 wherein said catalyst composition comprises copper and nickel.

13. The process of claim 1 wherein said catalyst composition comprises copper/nickel boride.

14. The process of claim 1 wherein said catalyst composition comprises palladium and tin.

15. The process of claim 1 wherein said catalyst composition comprises nickel boride.

16. The process of claim 1 wherein said actinic light is ultraviolet light.

17. The process of claim 1 wherein said base comprises a polyimide composition.

18. The process of claim 1 wherein said base comprises a polyester composition.

19. The process of claim 1 wherein said base comprises a polyolefin composition.

20. The process of claim 1 wherein said base comprises a polycarbonate composition.

21. The process of claim 1 wherein said base comprises a polyetherimide composition.

22. The process of claim 1 wherein said substrate comprises a composite of a resin and a reinforcing component.

23. The process of claim 1 wherein said patterned photosensitive resin composition comprises an epoxy containing resin composition.

24. The process of claim 1 wherein said patterned photosensitive resin composition comprises a novolak containing resin composition.

25. The process of claim 1 wherein said patterned photosensitive resin composition comprises acrylic containing resin composition.

26. The process of claim 1 wherein said patterned photosensitive resin composition comprises an unsaturated polyolefin containing resin composition.

27. The process of claim 1 wherein a second metal layer is bonded to said first metal layer bonded to the patterned resin.

28. The process of claim 1 wherein a second metal layer is electrolytically applied to said first electroless metal layer.

29. The process of claim 1 wherein a second metal layer is electrolessly applied to said first electroless metal layer.