Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition

• US 4,666,742 A
• Filed: 10/02/1985
• Issued: 05/19/1987
• Est. Priority Date: 05/11/1983
• Status: Expired due to Term

• Current Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Original Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Inventors: Kondo, Susumu, Nogami, Tatsuya, Takakura, Makoto
• Primary Examiner(s): Schofer, Joseph L.
• Assistant Examiner(s): Sarofim, N.
• Application Number:
  US06/783,131
• Time in Patent Office: 594 Days
• Field of Search: 427/229, 428/457
• US Class Current: 427/229
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 5/0091 Complexes with metal-heteroatom-bonds
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/121 Metallo-organic compounds
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A polymer composition comprising a polymer and an organic metal complex uniformly dispersed or dissolved therein.

Claims

1. A method for producing a metallized polymer, which comprises:

(a) contacting a polymer film comprising a polymer and an organic metal complex, wherein the weight ratio of the polymer to the metal of said organic metal complex ranges from 99.9;

0.1 to 80;

20, with a metallizing board made of copper or a copper alloy;

(b) forming metal layer on the surface of said film from the liberated metal from said organic metal complex by heating the polymer film and metallizing board of step (a); and

(c) recovering a polymer film with a metallized surface thereon.

2. The method according to claim 1, wherein the central metal of the organic metal complex is at least one metal selected from the group consisting of metals of Groups IV-A, V-A, VII-A, VIII and I-B of the Periodic Law Table.

3. The method acccrding to claim 1, wherein the central metal is at least one metal selected from the group consisting of titanium, zirconium, vanadium, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, ruthenium, rhodium, iridium, palladium, osmium, platinum, copper, silver and gold.

4. The method according to claim 1, wherein the ligand of the organic metal complex is at least one ligand selected from the group consisting of a tertiary phosphine, a tertiary phosphite, carbon monoxide, an aliphatic or alicyclic olefin, a conjugated olefin, an aryl compound, a heterocyclic compound, an organic cyano compound, an organic isonitrile compound, an organic mercapto compound, a compound having an alkyl group, a vinyl group, an allyl group, an ethynyl group or an acyl group, halogen, oxygen, hydrogen and nitrogen.

5. The method according to claim 1, wherein the ligand of the organic metal complex is at least one ligand selected from the group consisting of triphenylphosphine, tributylphosphine, triethylphosphine, triphenylphosphite, tributylphosphite, triethylphosphite, carbon monoxide, cyclooctadiene, a substituted or unsubstituted cyclopentadiene, cyclooctatetraene, butadiene, pentadiene, a substituted or unsubstituted benzene, acetonitrile, benzonitrile, a compound having a lower alkyl group or a benzyl group, ethylene, propylene, isobutylene, t-butyl-isonitrile, vinyl-isonitrile, benzo-isonitrile, a substituted or unsubstituted acetylene, acetylacetone, ethyl acetyl acetonate, pyridine, thiophene, quinoline, furan, 2,2'"'"'-dipyridyl, ethylenedithiol, toluene-3,4-dithiol, chlorine and bromine.

6. The method according to claim 1, wherein the polymer is at least one polymer selected from the group consisting of an ionomer resin, an acrylonitrile-acrylic-styrene resin, an acrylonitrile-styrene resin, an acrylonitrile-butadienestyrene resin, a methylmethacrylate-butadiene-styrene resin, a phenoxy resin, an ethylene-vinylchloride copolymer, an ethylene-vinylacetate copolymer, a polystyrene, a polyvinylidene chloride, a vinyl acetate, a polyethylene, a polypropylene, a polybutadiene, a polyvinylidene fluoride, a polytetrafluoroethylene, a polyacetal, a polyamide, a polyamide-imide, a polyarylate, a polyether-imide, a polyether-ether ketone, a polyethyleneterephthalate, a polybutyleneterephthalate, a polycarbonate, a polysulphone, a polyethersulphone, a polyphenylene oxide, a polyphenylene sulfide, a polymethylmethacrylate, a guanamine resin, a diallylphthalate resin, a vinyl ester resin, a phenol resin, an unsaturated polyester resin, a furan resin, a polyimide resin, a poly-p-hydroxybenzoate, a urethane resin, a melamine-formaldehyde resin, a urea-formaldehyde resin, an epoxy resin and a xylene-formaldehyde resin.

7. The method according to claim 1, wherein the polymer is at least one rubber-like polymer selected from the group consisting of a styrene-butadiene rubber, a polybutadiene rubber, a polyisoprene rubber, an acrylonitrile-butadiene rubber, a polychloroprene rubber, a butyl rubber, a urethane rubber, an acrylate rubber, a silicone rubber, a fluorinated rubber, a styrene-block copolymer, a thermoplastic elastomer polyolefin, a thermoplastic elastomer polyvinylchloride, a thermoplastic elastomer polyurethane, a thermoplastic elastomer polyester, a thermopolastic elastomer polyamide, a thermoplastic elastomer fluorinated resin and a natural rubber.

8. The method of claim 19 wherein said metallizing board is partially coated with a resin not capable of inducing metallization.

9. The method of claim 8, wherein the surface of the recovered metallized polymer contains a pattern.