Semiconductor chip interface

• US 4,667,219 A
• Filed: 04/27/1984
• Issued: 05/19/1987
• Est. Priority Date: 04/27/1984
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Trilogy Computer Development Partners, Ltd.
• Inventors: Beck, Richard L., Quinn, Robert F., Sochor, Jerzy R., Lee, James C. K., Amdahl, Gene M.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US06/604,783
• Time in Patent Office: 1,117 Days
• Field of Search: 357/80, 357/82, 357/81, 357/75, 357/68, 357/80, 357/82, 357/81, 357/75, 357/68, 357/74
• US Class Current: 257/693
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate

Abstract

A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.

Claims

1. A semiconductor chip module comprising:

a semiconductor chip having an exposed front face with a two-dimensional array of contacts thereon;

a connector plate immediately proximate the front face of the chip having a plurality of apertures corresponding to and aligned with the contacts on the semiconductor chip;

a plurality of transmission means located proximate the connector plate opposite from the semiconductor chip; and

a plurality of flexible conductor means extending through respective apertures of the connector plate, wherein individual conductor means are soldered at one end to a contact on the chip and at the other end to the transmission means.

2. The module of claim 1 wherein the connector plate is constructed of rigid material, and wherein each conductor means comprises deformable material located in the associated aperture in the connector plate, and a conductor extending through the deformable material.

3. The module of claim 2 wherein the deformable material has a drilled hole, and wherein the conductor comprises conductive material plated in the drilled hole.

4. The module of claim 2 wherein the deformable material is silicone rubber.

5. The module of claim 1 wherein the each conductor means comprises an elongate, electrically conductive element having a curved portion intermediate its ends to provide flexibility.

6. The module of claim 5 wherein each conductive element has an S-shape intermediate its ends.

12. The module of claim 1 wherein the dimensional array of contacts on the semiconductor chip includes signal contacts, and wherein the conductor means includes signal conductor means.

13. The module of claim 1, 7 or 10 wherein the two dimensional array of contacts on the semiconductor chip includes power and ground contacts, and the transmission means includes power and ground transmission means.

14. The module of claim 1, 7, or 10 and additionally comprising a heat sink with a flat surface, the semiconductor chip having a back face attached flush to the flat surface of the heat sink.

15. The module of claim 14 wherein the heat sink is water cooled.

16. The module of claim 14 wherein the heat sink is air cooled.

17. The module of claim 1, 7 or 10 wherein the semiconductor chip has an area of approximately 3,600 square millimeters.

18. The module of claim 1, wherein the connector plate is constructed of a resilient material and the flexible conductor means are metal wires.

19. The module of claims 1, 7 or 10, wherein the transmission means comprises a printed circuit board.

20. The module of claims 1, 7 or 10, wherein the transmission means comprises a power plate, a ground plate, and a signal lead sheet.

7. A semiconductor chip module comprising:

a semiconductor chip having an exposed front face with a two dimensional array of contacts thereon;

a rigid connector plate proximate the front face of the chip having a plurality of apertures corresponding to and aligned with the contacts of the semiconductor chip, the aperatures being filled with a deformable material having a central subaperture with a conductive material plated in the subaperture; and

transmission means located proximate the connector plate on the side opposite from the semiconductor chip;

wherein said conductive material is fixed at one end to a contact on the chip and is fixed at the other end to said transmission means.

8. The module of claim 7 wherein the deformable material is silicone rubber.

9. The module of claim 7 wherein the plated material is plated copper.

10. A semiconductor chip module comprising:

a semiconductor chip having an exposed front face with a two dimensional array of contacts thereon;

a rigid connector plate proximate the front face of the chip having a plurality of apertures corresponding to and aligned with the contacts on the semiconductor chip;

transmission means located proximate the connector plate opposite from the semiconductor chip; and

a plurality of S-shaped wires extending through respective apertures of the connector plate, wherein one end of each wire is soldered to a contact on the chip and the other end of the wire is soldered to the transmission means.

11. The module of claim 10 wherein the wires are constructed of copper.