Flexible solder socket for connecting leadless integrated circuit packages to a printed circuit board

• US 4,668,032 A
• Filed: 09/26/1984
• Issued: 05/26/1987
• Est. Priority Date: 04/08/1982
• Status: Expired due to Fees

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Bouvier, Ray A., Hesch, Leonard T. Jr.
• Primary Examiner(s): DESMOND, EUGENE
• Application Number:
  US06/654,573
• Time in Patent Office: 972 Days
• Field of Search: 339/17 CF, 339/17 GM, 339/174, 174/52 FP
• US Class Current: 439/68
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: H05K 7/1076 co-operating by sliding
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A connector arrangement for interconnecting a leadless integrated circuit package to a printed circuit board by means of a flexible solder socket, for eliminating the problems of thermal stress and vibration in the chip-to-printed circuit board connection. The arrangement includes a plurality of substantially L-shaped flexible connectors arranged in a pattern along the edge of an insulated substrate that coincides with the arrangement of chip contact areas on the periphery of the integrated circuit package that is to be connected to the printed circuit board. Bottom portions of the L-shaped flexible connectors are soldered to the conductor highways on the printed circuit board. The upper leg portion of the L-shaped flexible joint connector member is bent around the edge of the insulated carrier and contacts chip contact layers along the edge of the integrated circuit chip. In the region of the edge of the insulated carrier substrate where the L-shaped member is bent, there is no bonding between the substrate and the L-shaped flexible connector, permitting the upper leg of the L-shaped flexible connector to flex in a direction parallel to the surface of the printed circuit board. A solder connection is provided between the contact layers on the edge of the integrated circuit chip and the upper arm of the L-shaped flexible connector. Those portions of the L-shaped flexible connector which are soldered to either the chip or the board undergo substantially no stress.

Claims

1. A multiple contact electrical connector arrangement connecting terminal contacts of a leadless integrated circuit package to a printed circuit board comprising, in combination:

an insulated carrier substrate having top and bottom surfaces and a side surface portion therebetween;

a plurality of flexible connector elements disposed along the periphery of said substrate in an arrangement corresponding to that of the terminal contacts of said leadless integrated circuit package, each of said elements having a first portion, affixed to said insulated carrier substrate at said bottom surface thereof and adapted to be bonded to a respective conductor path provided on said printed circuit board, and a second portion, extending from said first portion around said side surface portion of said substrate by which said periphery thereof is defined so as to form a separation between said side surface portion and said second portion, said second portion being flexibly translatable in the region of said side surface portion of said substrate; and

wherein

said first portion of a respective flexible connector element is bonded to a conductor path provided on said printed circuit board, and

said second portion of said respective flexible connector element is bonded to a terminal contact of said leadless integrated circuit package at a location on said second portion of said respective flexible connector element spaced apart from said region of said side surface portion of said substrate.

2. A multiple contact electrical connector arrangement according to claim 1, wherein said first portion of a respective flexible connector element is bonded to a portion of said bottom surface of said insulated carrier substrate adjacent to said side surface portion of said substrate, said bottom surface of said substrate facing said printed circuit board.

3. A multiple contact electrical connector arrangement according to claim 1, wherein said first portion of a respective flexible connector element is molded into a portion of said bottom surface of said insulated carrier substrate adjacent to said side surface portion of said substrate, said bottom surface of substrate facing said printed circuit board.

4. A multiple contact electrical connector arrangement according to claim 1, wherein a respective flexible connector element is substantially L-shaped, said first portion of said flexible connector element corresponding to one leg of said L and said second portion of said flexible connector element corresponding to the other leg of said L.

5. A multiple contact electrical connector arrangement according to claim 4, wherein the end of said other leg of said L not joined with said one leg of said L is bent away from said insulated carrier substrate.

6. A multiple contact electrical connector for use in connecting terminal contacts of a leadless integrated circuit package to conductor paths provided on a printed circuit board comprising:

an insulated carrier substrate having top and bottom surfaces and a side surface portion therebetween; and

a plurality of flexible connector elements disposed along the periphery of said substrate in an arrangement corresponding to that of the terminal contacts of said leadless integrated circuit package, each of said elements having

a first portion, affixed to said insulated carrier substrate at a bottom surface portion thereof and being adapted to be bonded to a respective conductor path provided on said printed circuit board, and

a second portion, extending from said first portion around said side surface portion of said substrate by which said periphery thereof is defined, so as to form a separation between said side surface portion and said second portion, said second portion being flexibly translatable in the region of said side surface portion of said substrate and being urged in mechanical contact with a corresponding terminal contact of said leadless integrated circuit package by the placing of said leadless integrated circuit package upon the top surface of said insulated carrier substrate and being adapted to be bonded to a respective terminal contact of said leadless integrated circuit package at a location on said second portion spaced apart from said region of said side surface portion of said substrate.

7. A multiple contact electrical connector according to claim 6, wherein said first portion of a flexible connector element is bonded to a region of said bottom surface of said insulated carrier substrate adjacent to said side surface portion but exclusive of said side surface portion.

8. A multiple contact electrical connector according to claim 6, wherein said first portion of a flexible contact element is formed integrally with a region of said bottom surface portion of said insulated carrier substrate adjacent to said side surface portion of said substrate.

9. A multiple contact electrical connector according to claim 6, wherein said top and bottom surface portions of said insulated carrier substrate are substantially parallel with each other.

10. A multiple contact electrical connector according to claim 6, wherein said second portion of a flexible connector element is inclined toward said top surface of said insulated carrier substrate.

11. A multiple contact electrical connector according to claim 6, wherein said second portion of a respective flexible connector element is adapted to be soldered to a side portion of a respective terminal contact of said leadless integrated circuit package at a location on said second portion spaced apart from said region of said side surface portion of said substrate.

12. A multiple contact electrical connector according to claim 6, wherein a respective flexible connector element is substantially L-shaped, said first portion of said flexible connector element corresponding to one leg of said L and said second portion of said flexible connector element corresponding to the other leg of said L.

13. A multiple contact electrical connector according to claim 12, wherein the end of said other leg of said L not joined with said one leg of said L is bent away from said insulated carrier substrate.

14. A multiple contact electrical connector according to claim 6, wherein said second portion of a respective flexible connector element is bent inwardly, in the direction of the leadless integrated circuit package to be received thereby, and outwardly at the end thereof.

15. A multiple contact electrical connector according to claim 14, wherein said second portion of a respective flexible connector element is adapted to be soldered to the side portion of said leadless integrated circuit package at the inwardly bent portion of said second portion, the end of which is bent outwardly therefrom.

16. A multiple contact electrical connector arrangement connecting terminal contacts of a leadless integrated circuit package to a printed circuit board comprising, in combination:

an insulated carrier substrate having top and bottom surfaces and a side surface portion therebetween;

a plurality of flexible connector elements arranged on said substrate in correspondence with the terminal contacts of said leadless integrated circuit package, each of said elements having a first portion affixed to said insulated carrier substrate at said bottom surface thereof and adapted to be bonded to a respective conductor path provided on said printed circuit board, and a second portion extending from said first portion around said side surface portion of said substrate so as to form a separation between said side surface portion and said second portion and being flexibly translatable in the region of said side surface portion of said substrate so as to be engageable by the terminal contacts of said leadless integrated circuit package at a side portion of said leadless integrated circuit package, said second portion being also flexibly translatable in the region of said side portion of said leadless integrated circuit package to be engaged thereby; and

wherein

said first portion of a respective flexible connector element is connected to a conductor path provided on said printed circuit board, and

said second portion of said respective flexible connector element is connected to a terminal contact of said leadless integrated circuit package at a location on said second portion of said respective flexible connector element spaced apart from said first portion of said connector element.

17. A multiple contact electrical connector arrangement according to claim 16, wherein said second portion of a respective flexible connector element is bent inwardly, in the direction of the leadless integrated circuit package to be received thereby, and outwardly at the end thereof.

18. A multiple contact electrical connector for use in connecting terminal contacts of a leadless integrated circuit package to conductor paths provided on a printed circuit board comprising:

an insulated carrier substrate having top and bottom surfaces and a side surface portion therebetween; and

a plurality of flexible connector elements arranged on said substrate in correspondence with the terminal contacts of said leadless integrated circuit package, each of said elements having

a first portion, affixed to said insulated carrier substrate at a bottom surface portion thereof and being adapted to be connected to a respective conductor path provided on said printed circuit board, and

a second portion, extending from said first portion so as to be extendable around a side portion of said substrate so as to form a separation between said side surface portion and said second portion, said second portion being flexibly translatable in the region of said side surface portion of said substate and said side portion of said leadless integrated circuit package so as to be mechanically urged in contact with a respective terminal contact of said leadless integrated circuit package upon said insulated carrier substrate and adapted to be electrically connected to said respective terminal contact of said leadless integrated circuit package at a location on said second portion spaced apart from said first portion of said connector element.

19. A multiple contact electrical connector according to claim 18, wherein said second portion of a respective flexible connector element is bent inwardly, in the direction of the leadless integrated circuit package to be received thereby, and outwardly at the end thereof.

20. A multiple contact electrical connector according to claim 18, wherein said second portion of a respective flexible connector element is adapted to be soldered to a side portion of a respective terminal contact of said leadless integrated circuit package at a location on said second portion spaced apart from said region of said side surface portion of said substrate.

21. A multiple contact electrical connector according to claim 19, wherein said second portion of a respective flexible connector element is adapted to be soldered to the side portion of said leadless integrated circuit package at the inwardly bent portion of said second portion, the end of which is bent outwardly therefrom.