Bonding electrical conductors and bonded products
First Claim
1. An electrical assembly comprising a circuit component and at least one conductor device external of the circuit component, the circuit component including at least one metal contact element, the conductor device including a laminate of a metal strip and a layer of insulant material having one surface contiguous with the metal strip and the other surface adjacent the metal contact element, a first surface of the metal strip adjacent the metal contact element being bonded thereto to form an electrical connection by a friction bonding process in which a rotating surface portion of a rotating friction wheel is placed in contact with an exposed surface of an additional layer overlying a second surface of the metal strip opposite the first surface, a portion of the insulant material disposed between the metal strip and the metal contact element being displaced from between the metal strip and the metal contact element by the friction bonding process so as to expose the one surface of the metal strip adjacent the metal contact element to enable bonding of the metal strip to the metal contact element.
4 Assignments
0 Petitions
Accused Products
Abstract
Bonds between a contact area of a circuit of a semiconductor and a conductor are formed by applying a rotating tool to an opposed surface of the conductor or to an intervening material superposed on it. The conductor may be laminated to one or more layers of insulant material and when that material is for example polyester, the bond may be formed without prior removal of the insulant from between the contact area and the conductor; it is displaced by the effect of the tool. The areas and conductors may be in an array and the tool be brought across the members of the array in succession.
42 Citations
16 Claims
- 1. An electrical assembly comprising a circuit component and at least one conductor device external of the circuit component, the circuit component including at least one metal contact element, the conductor device including a laminate of a metal strip and a layer of insulant material having one surface contiguous with the metal strip and the other surface adjacent the metal contact element, a first surface of the metal strip adjacent the metal contact element being bonded thereto to form an electrical connection by a friction bonding process in which a rotating surface portion of a rotating friction wheel is placed in contact with an exposed surface of an additional layer overlying a second surface of the metal strip opposite the first surface, a portion of the insulant material disposed between the metal strip and the metal contact element being displaced from between the metal strip and the metal contact element by the friction bonding process so as to expose the one surface of the metal strip adjacent the metal contact element to enable bonding of the metal strip to the metal contact element.
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16. An electrical assembly comprising a circuit component and at least one conductor device external of the circuit component, the circuit component including a plurality of metal contact elements, the conductor device including a laminate of a plurality of metal strips and a layer of insulant material having one surface contiguous with the metal strips and the other surface adjacent the metal contact elements, the metal strips being aligned with respective ones of the metal contact elements, a first surface of each of the metal strips adjacent the respective metal contact elements being bonded thereto to form electrical connections by a friction bonding process in which a rotating surface portion of a rotating friction wheel is placed in contact with an exposed surface of an additional layer overlying a second surface of each of the metal strips opposite the respective first surface, each portion of the insulant material disposed between one of the metal strips and the metal contact element adjacent thereto being displaced from between the metal strip and the metal contact element by the friction bonding process so as to expose the one surface of each of the metal strips adjacent the metal contact elements to enable bonding of the metal strips to the metal contact elements.
Specification