×

Semiconductor module for a high-speed switching arrangement

  • US 4,670,833 A
  • Filed: 06/03/1985
  • Issued: 06/02/1987
  • Est. Priority Date: 06/01/1984
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor module for a high-speed power switching arrangement, the module comprising an active semiconductor switching elements and a freewheel diode each having first and second terminals, said first terminal of said semiconductor switching element and said first terminal of said freewheel diode being connected to each other and constituting a common terminal for connection to a load, a pair of conductor layers each connected to a respective one of said second terminals of said semiconductor switching element and said freewheel diode and each adapted to be connected to a respective one of the terminals of a direct current voltage source, said semiconductor switching element and said freewheel diode each being disposed in direct proximity to each other and to said pair of conductor layers, and an insulating layer between said conductor layers such that said conductor layers are disposed geometrically parallel and in direct proximity to each other, whereby upon said common terminal of said semiconductor switching element and said freewheel diode being connected to a load and therethrough to one of the terminals of a direct current voltage source and upon said conductor layers being connected to said respective terminals of said direct current voltage source, current flows relative to said common terminal in the same direction through said pair of conductor layers toward said semiconductor switching element and said freewheel diode, respectively.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×