Method of mounting electronic parts on the predetermined positions of a printed circuit board

• US 4,670,981 A
• Filed: 02/28/1986
• Issued: 06/09/1987
• Est. Priority Date: 03/17/1986
• Status: Expired due to Term

• Current Assignee: Nitto Kogyo KK (NEPRO JAPAN)
• Original Assignee: Nitto Kogyo KK (NEPRO JAPAN)
• Inventors: Kubo, Masahiro, Kubota, Shigeru, Kanou, Shoji
• Primary Examiner(s): Goldberg, Howard N.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US06/834,924
• Time in Patent Office: 466 Days
• Field of Search: 29/840, 29/407, 29/467, 29/464, 29/834, 228/6.2, 33/180 R, 33/184.5
• US Class Current: 29/840
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0482 using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49778 with aligning, guiding, or instruction

Abstract

A method of mounting electronic parts on the predetermined positions of a printed circuit board is disclosed which is capable of simultaneously correcting the misregistration of a plurality of electronic parts by one cycle of operations so as to precisely position and mount the electronic parts on the printed circuit board. In the present invention, the misregistration of individual electronic parts with respect to suction tubes of a suction head in an automatic chip-mounting apparatus is corrected at the time when the suction tubes suck up the electronic parts from the cavities of the jig in which the electronic parts are charged to thereby place each of the suction tubes on the predetermined or exact suction position of the electronic parts or align the center of each of the electronic parts with that of the corresponding suction tube.

Claims

1. A method of mounting electronic parts on the predetermined positions of a printed circuit board comprising the steps of:

charging said electronic parts in each of cavities of a jig in an automatic chip-mounting apparatus, said cavities each having an x-axial dimension Lx1 and a y-axial dimension Ly1, said electronic parts each having an x-axial dimension Lx2 and a y-axial dimension Ly2, thereby creating a first and second clearances lx in the x-axial direction between each of said cavities and said electronic parts and a first and second clearances ly in the y-axial direction between each of said cavities and said electronic parts;

sucking up said electronic parts in said cavities by means of suction tubes in said automatic chip-mounting apparatus;

moving said suction tubes upwardly within said cavities while holding said electronic parts on said suction tubes;

moving said suction tubes in a first and second x-axial directions;

returning said suction tubes to the center of said cavities by moving said suction tubes in the x-axial direction;

moving said suction tubes in a first and second y-axial directions;

returning said suction tubes to the center of said cavities by moving said suction tubes in the y-axial direction, thereby permitting each of said electronic parts to collide with the inner wall of said cavity in the first and second x- and y-axial directions and permitting the center of said suction tube, electronic part and cavity to align with one another due to relative motion of said suction tube with respect to said electronic parts;

moving said suction tubes each having said electronic parts sucked up aligning the center of said electronic parts with that of said cavities onto said printed circuit board; and

releasing said electronic parts from said suction tubes to be mounted on the predetermined positions of said printed circuit board.

2. The method of mounting electronic parts on the predetermined position of a printed circuit board as defined in claim 1, wherein each of said first and second clearances in the x-axial direction is represented by the expression of Lx1-Lx2/2.

3. The method of mounting electronic parts on the predetermined position of a printed circuit board as defined in claim 1 or 2, wherein each of said first and second clearances in the y-axial direction is represented by the expression of Ly1-Ly2/2.

4. The method of mounting electronic parts on the predetermined position of a printed circuit board as defined in claim 1, wherein said suction tubes are moved by a distance equivalent to said clearance lx in the first x-axial direction and then moved by a distance equivalent to two times as much as said clearance lx in the second x-axial direction.

5. The method of mounting electronic parts on the predetermined position of a printed circuit board as defined in claim 1, wherein said suction tubes are moved by a distance equivalent to said clearance ly in the first y-axial direction and then moved by a distance equivalent to two times as much as said clearance ly in the second y-axial direction.