Integrated circuit packages

• US 4,672,418 A
• Filed: 04/08/1985
• Issued: 06/09/1987
• Est. Priority Date: 04/11/1984
• Status: Expired due to Fees

• Current Assignee: The M-O Valve Company Limited
• Original Assignee: The M-O Valve Company Limited
• Inventors: Moran, Peter, Vyse, Barry
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US06/721,236
• Time in Patent Office: 792 Days
• Field of Search: 357/70, 357/74, 357/72, 174/52 FP
• US Class Current: 257/671
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit package including a lead frame (11) sealed between base and cap portions (1 and 3) of the package enclosure. Outwards of the seal each lead (13) in the frame (11) follows an angled path so that manipulation of leads outside the package is unlikely to damage the seal. The angling of the leads (13) is effected by appropriately shaping the cap and base parts (1 and 3) of the package.

Claims

1. An integrated circuit package comprising:

(a) a base part in the form of a rectangular plate having an upper surface, a lower planar surface, and an outer periphery,

(b) an integrated circuit element mounted on the upper surface of said base part,

(c) a cap part in the form of a rectangular planar portion having a peripheral flange having an inner surface which is a close fit around the outer periphery of said base part,

(d) sealing means sealing said planar portion of said cap part to said base part to form an enclosure for said integrated circuit element,

(e) connecting leads extending from said integrated circuit element through said sealing means, each said connecting lead having;

(f) a first portion extending outwardly with respect to said sealing means between said planar portion of the cap part and the upper surface of the base part,

(g) an intermediate portion extending at right angles to said first portion and between the inner surface of said peripheral flange and the outer periphery of said base part,

(h) a second portion for connection to other circuit elements extending at right angles to said intermediate portion and outwardly beyond said peripheral flange in a plane which is substantially coplanar and flush with the lower surface of said base part,

(i) a pair of respective inner and outer rectangular lead frames spaced apart of each other and both concentrically surrounding said base part, and supporting said second portions of said connecting leads, and

(j) said second portions of said connecting leads fanning outwardly in the space between said inner and outer lead frames.

2. An integrated circuit package as claimed in claim 1, wherein the cap part has a central opening in which the circuit element is hused, and a lid is sealed over said opening to complete the enclosure.

3. An integrated circuit package as claimed in claim 1, and further comprising four strips, each strip extending from an apex of the rectangular base plate to the corresponding apices of said inner and outer lead frames, said strips being of greater cross-sectional area than said leads but being of the same material.

4. A package according to claim 3 wherein each frame consists of a polymide material.

5. A package according to claim 3 wherein between said two frames each lead is provided with an enlarged contact pad area.

6. A package according to claim 3 wherein each strip is provided with at least one hole to assist in positioning the package in use.

7. A package according to claim 3 and an outer rim which interconnects and supports the second portions of said leads and each strip.

8. A package according to claim 7 wherein said outer rim is provided with at least one hole to assist in positioning the package in use.

9. A package according to claim 1 wherein one of said parts includes an insert of a material of relatively high thermal conductivity compared with the remainder of said one part, thereby to facilitate the conduction of heat away from the integrated circuit element.

10. A package according to claim 1 wherein said parts consist of ceramic material.

11. A package according to claim 10 wherein said parts consist of alumina.

12. A package according to claim 1 wherein said sealing means constitutes a glass seal.