Detector array module fabrication process
First Claim
Patent Images
1. A method for fabricating a photo-detector array module comprising:
- providing a number of equal-sized semiconductor chips, each having integrated circuitry thereon, and each having a multiplicity of closely spaced electrical contact points at one end thereof;
stacking and bonding the semiconductor chips to form a rectangular parallelepiped structure with the electrical contact points in an array of closely spaced points on the focal plane end of the stacked chips;
etching the focal plane ends of the stacked chips to remove a small amount of the body material of the chips while leaving the contact points protruding;
depositing insulation material to cover the etched focal plane ends of the stacked chips;
removing sufficient material from the insulation-covered ends of the stacked chips to uncover the electrical contact points; and
placing a multiplicity of photo-detectors on the insulation-covered ends of the stacked chips in such a way that each photo-detector is in electrical contact with a single electrical contact point, while being otherwise insulated from the body material of the semiconductor chips.
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Abstract
A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
84 Citations
15 Claims
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1. A method for fabricating a photo-detector array module comprising:
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providing a number of equal-sized semiconductor chips, each having integrated circuitry thereon, and each having a multiplicity of closely spaced electrical contact points at one end thereof; stacking and bonding the semiconductor chips to form a rectangular parallelepiped structure with the electrical contact points in an array of closely spaced points on the focal plane end of the stacked chips; etching the focal plane ends of the stacked chips to remove a small amount of the body material of the chips while leaving the contact points protruding; depositing insulation material to cover the etched focal plane ends of the stacked chips; removing sufficient material from the insulation-covered ends of the stacked chips to uncover the electrical contact points; and placing a multiplicity of photo-detectors on the insulation-covered ends of the stacked chips in such a way that each photo-detector is in electrical contact with a single electrical contact point, while being otherwise insulated from the body material of the semiconductor chips. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for fabricating a photo-detector array module comprising:
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providing a number of equal-sized semiconductor chips, each having integrated circuitry thereon, and each having a plurality of electrical contact points at one end thereof provided by the ends of the metal leads formed as part of the integrated circuitry on the substrate; stacking and bonding the semiconductor chips to form a rectangular parallelepiped structure with the electrical contact points on the back plane end of the stacked chips; etching the back plane end of the stacked chips to remove a small amount of the body material of the chips to leave the contact points protruding; depositing insulation material on the etched ends of the stacked chips to cover the back plane; removing sufficient material from the back plane to uncover the electrical contact points; forming thin film conductors on the back plane to make contact with appropriate electrical contact points thereon, each conductor extending across the end of its contact points to provide a T-shaped junction; and providing electrical connections leading from the conductors on the back plane to exterior circuitry. - View Dependent Claims (9)
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10. A method for fabricating a photo-detector array module comprising:
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providing a number of equal-sized semiconductor chips, each having a semiconductor substrate with integrated circuitry thereon, and each having a multiplicity of closely spaced electrical contact points at one end thereof provided by the ends of the metal leads formed as part of the integrated circuitry on the substrate; stacking and bonding the semiconductor chips to form a rectangular parallelepiped structure with the electrical contact points in an array of closely spaced points on the focal plane ends of the stacked chips; etching the focal plane ends of the stacked chips to remove a small amount of the body material of the chips while leaving the contact points protruding; depositing insulation material to cover the etched focal plane ends of the stacked chips; removing sufficient material from the insulation-covered ends of the stacked chips to uncover the electrical contact points; and placing a multiplicity of photo-detectors on the insulation-covered ends of the stacked chips in such a way that each photo-detector is in electrical contact with a single electrical contact point, while being otherwise insulated from the body material of the semiconductor chips. - View Dependent Claims (11, 12)
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13. A method for fabricating an electro-optical array module comprising:
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providing a number of equal-sized semiconductor chips, each having integrated circuitry thereon, and each having a multiplicity of closely spaced electrical contact points at one end thereof; stacking and bonding the semiconductor chips to form a rectangular parallelepiped structure with the electrical contact points in an array of closely spaced points on a planar surface formed by the ends of the stacked chips; etching the planar-surface-forming ends of the stacked chips to remove a small amount of the body material of the chips while leaving the contact points protruding; depositing insulation material to cover the etched ends of the stacked chips; and removing sufficient material from the insulation-covered ends of the stacked chips to uncover the electrical contact points. - View Dependent Claims (14, 15)
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Specification