Method of making a micromechanical electric shunt

• US 4,674,180 A
• Filed: 05/01/1984
• Issued: 06/23/1987
• Est. Priority Date: 05/01/1984
• Status: Expired due to Term

• Current Assignee: Invensys Systems Incorporated (Invensys PLC)
• Original Assignee: The Foxboro Company (Schneider Electric SE)
• Inventors: Zavracky, Paul M., Morrison, Richard H. Jr.
• Primary Examiner(s): Echols, Percy W.
• Application Number:
  US06/606,065
• Time in Patent Office: 1,148 Days
• Field of Search: 29/622, 29/885, 427/96, 427/58, 427/79, 200/181, 430/314, 156/644, 156/652, 156/656, 156/659.1, 156/661.1
• US Class Current: 29/622
• CPC Class Codes: B81B 2203/0353 Holes
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 2201/056 Releasing structures at the end of the manufacturing process
• CPC Class Codes: G06K 19/067 Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: Y10T 29/49105 Switch making
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.

Claims

1. The method of making a micromechanical electric shunt on a substrate having a planar top surface, comprising the steps of:

(a) preparing an insulating substrate by cleaning and drying the top surface thereof;

(b) depositing a first metallic covering layer on the top surface of said substrate;

(c) depositing a second metallic layer on the top surface of said first metallic layer;

(d) removing excess of said metallic layers from around two spaced apart areas of said metallic layers to produce a first metallic terminal and a second metallic terminal, by etching;

(e) depositing a removable third metallic layer over the top surface of said substrate, including said first terminal and said second terminal;

(f) etching a first hole through said third metallic layer to said first terminal and etching a second hole into said third metallic layer to form a surface within said third metallic layer and which is separated from said second terminal;

(g) providing an elongated cantilever beam plating surface resist pattern around and between said first and second holes on said third metallic layer;

(h) depositing a fourth metallic layer on said third metallic layer within said cantilever beam plating surface pattern to form a cantilever beam;

(i) removing said resist pattern;

(j) relieving said cantilever beam by removal of the entire third metallic layer; and

(k) cleaning the micromechanical electric shunt.

2. The method of claim 1, wherein said substrate is glass.

3. The method of claim 1, wherein said first metallic layer is chromium.

4. The method of claim 1, wherein said second metallic layer is gold.

5. The method of claim 4, wherein said second metallic layer is between 2,000 and 3,000 Angstroms thick.

6. The method of claim 1, wherein said third metallic layer is nickel.

7. The method of claim 6, wherein said third metallic layer is between 1 and 2 microns thick.

8. The method of claim 1, further including the step of depositing an electrical resistance layer on said second terminal last before step (e).

9. The method of claim 8, wherein said electrical resistance layer is selected from the group consisting of germanium, copper, an oxide of copper, silicon, or aluminum-bearing silicon.

10. The method of claim 1, further including forming in step (d) a force-plate terminal between said first and second metallic terminals.

11. The method of claim 1, further including additional repetitions of steps (a) through (k) to form a plurality of micromechanical electric shunts on a single substrate.

12. The method of claim 1, further including the additional process steps of:

forming first and second elongated, spaced apart, unconnected electrical contact buses, one of said buses including one of said first and second metallic terminals;

forming a fusible link between the other of said buses and the other of said first and second metallic terminals;

enlarging the other of said first and second metallic layers to form an expanded contact area.

13. The method of claim 1, further including the additional process steps of:

forming a capacitor electrically connected to and parallel with said micromechanical electrical shunt, and

forming a resistor electrically connected in series with said capacitor and shunt combination.