Method of making a micromechanical electric shunt
First Claim
Patent Images
1. The method of making a micromechanical electric shunt on a substrate having a planar top surface, comprising the steps of:
- (a) preparing an insulating substrate by cleaning and drying the top surface thereof;
(b) depositing a first metallic covering layer on the top surface of said substrate;
(c) depositing a second metallic layer on the top surface of said first metallic layer;
(d) removing excess of said metallic layers from around two spaced apart areas of said metallic layers to produce a first metallic terminal and a second metallic terminal, by etching;
(e) depositing a removable third metallic layer over the top surface of said substrate, including said first terminal and said second terminal;
(f) etching a first hole through said third metallic layer to said first terminal and etching a second hole into said third metallic layer to form a surface within said third metallic layer and which is separated from said second terminal;
(g) providing an elongated cantilever beam plating surface resist pattern around and between said first and second holes on said third metallic layer;
(h) depositing a fourth metallic layer on said third metallic layer within said cantilever beam plating surface pattern to form a cantilever beam;
(i) removing said resist pattern;
(j) relieving said cantilever beam by removal of the entire third metallic layer; and
(k) cleaning the micromechanical electric shunt.
7 Assignments
0 Petitions
Accused Products
Abstract
A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.
-
Citations
13 Claims
-
1. The method of making a micromechanical electric shunt on a substrate having a planar top surface, comprising the steps of:
-
(a) preparing an insulating substrate by cleaning and drying the top surface thereof; (b) depositing a first metallic covering layer on the top surface of said substrate; (c) depositing a second metallic layer on the top surface of said first metallic layer; (d) removing excess of said metallic layers from around two spaced apart areas of said metallic layers to produce a first metallic terminal and a second metallic terminal, by etching; (e) depositing a removable third metallic layer over the top surface of said substrate, including said first terminal and said second terminal; (f) etching a first hole through said third metallic layer to said first terminal and etching a second hole into said third metallic layer to form a surface within said third metallic layer and which is separated from said second terminal; (g) providing an elongated cantilever beam plating surface resist pattern around and between said first and second holes on said third metallic layer; (h) depositing a fourth metallic layer on said third metallic layer within said cantilever beam plating surface pattern to form a cantilever beam; (i) removing said resist pattern; (j) relieving said cantilever beam by removal of the entire third metallic layer; and (k) cleaning the micromechanical electric shunt. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification