Multi-layered solid-state image sensor for three-dimensional picture image processing

• US 4,675,535 A
• Filed: 10/30/1985
• Issued: 06/23/1987
• Est. Priority Date: 12/06/1984
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Harada, Nozomu, Tsunekawa, Shou
• Primary Examiner(s): LaRoche, Eugene R.
• Assistant Examiner(s): Mis, David
• Application Number:
  US06/792,884
• Time in Patent Office: 601 Days
• Field of Search: 250/211 R, 250/211 J, 250/578, 357/30, 357/76
• US Class Current: 250/208.1
• CPC Class Codes: H01L 31/09 Devices sensitive to infrared, visible or ultraviolet radiation H01L31/101 takes precedence
• CPC Class Codes: H04N 13/236 using varifocal lenses or mirrors
• CPC Class Codes: H04N 13/271 wherein the generated image signals comprise depth maps or disparity maps
• CPC Class Codes: H04N 23/673 based on contrast or high frequency components of image signals, e.g. hill climbing method

Abstract

A multi-layered solid state image sensor senses a three-dimensional optical image introduced through a lens having a constant focal length and a constant focal depth. The image sensor has a plurality of transparent layers stacked together with reflection preventive coating films sandwiched therebetween. A cell matrix is provided on each of the transparent layers. Cells included in each cell matrix are arranged so as not to overlap each other so that image light can effectively reach the lowermost layer. The cell matrices defining imaging surfaces on the stacked transparent layers become operative simultaneously for image sensing. Therefore, just-focused image planes at different focal points are formed on the cell matrices.

Claims

1. A solid state imaging device used to pick up a three-dimensional optical image of a three-dimensional object which is positioned before a lens section having a constant focal length and a constant focal depth, and which has a plurality of object points at different object distance along an optical axis of said lens section, said imaging device comprising;

a selected number of image sensing substrates, stacked along the optical axis so as to form a plurality of parallel focal surfaces, for becoming operative simultaneously to sense an optical image introduced thereonto through the lens section, and for generating two-dimensional image pickup signals which represent, respectively, just-focused image planes of the object points which are formed on the respective focal surfaces, each of said imago-sensing substrates comprising,

a transparent layer for allowing incident image light to be transmitted to reach an underlying image sensing substrate; and

a cell matrix having a plurality of picture elements which are formed on said transparent layer so as to be arranged at a predetermined interval, whereby said cell matrices are prevented from vertically overlapping each other along the optical axis, so that the three-dimensional image is sensed without moving the lens section.

2. The device according to claim 1, wherein the predetermined interval between the picture elements included in said cell matrix is increased in accordance with the selected number of said image sensing substrates.

3. The device according to claim 1, further comprising:

films sandwiched between said image sensing substrates, for preventing reflection from occurring when the incident image light is transmitted through the upper image sensing substrate of said stacked image sensing substrates and is incident on the lower image sensing substrate.

4. The device according to claim 3, wherein the selected number of said image sensing substrates is set to be an odd number.