Electronic chip-carrier heat sinks

• US 4,679,118 A
• Filed: 07/28/1986
• Issued: 07/07/1987
• Est. Priority Date: 08/07/1984
• Status: Expired due to Fees

• Current Assignee: Aavid Thermal Products Incorporated (Ansys Incorporated)
• Original Assignee: Aavid Thermal Products Incorporated (Ansys Incorporated)
• Inventors: Johnson, Philip A., McCarthy, Alfred F.
• Primary Examiner(s): Tolin, G. P.
• Application Number:
  US06/890,890
• Time in Patent Office: 344 Days
• Field of Search: 165/80 B, 174/16 HS, 174/52 FP, 357/81, 361/383, 361/386-388, 339/112 R, 339/17 C, 339/17 CF
• US Class Current: 361/718
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

Claims

1. An electronic chip-carrier mounting and heat sink, comprising a socket of insulating material having an outwardly-projecting array of electrical leads disposed for connection with circuit-board wiring and an inner array of electrical contacts framing an upwardly-opened recess in said socket and disposed to engage edge contacts of a leadless chip carrier which may be nested therein and thereby couple such edge contacts with said leads, and a single-piece composite heat-sink and cover means stamped from sheet metal having good thermal conductivity and adapted for dissipation of heat from such a carrier which may be nested in said recess and for movements between a closed position in which it presses against and closes over such a carrier and an open position in which it releases such a carrier from said socket, said composite heat-sink and cover means including a relatively broad-area central heat-sink portion having a substantially planar and uninterrupted lower heat-transfer surface disposed to press against a surface of the same size and shape as the top of such a carrier nested in said recess and further having stamped sheet-metal heat-radiating members integral therewith along edges thereof bent to extend upwardly away from said surface and from the top of such a carrier, said heat-transfer surface of said central portion conducting heat from such a carrier laterally to said heat-radiating members along said edges thereof and said heat-radiating members in turn convectively releasing the heat to an ambient atmosphere, and said composite heat-sink and cover means including fastener means disposed laterally beyond the periphery of said central heat-sink portion, said fastener means selectably cooperating with fastener provisions on said socket in allowing said composite heat-sink and cover means to move between the said open and closed positions and in releasably holding it closed over such a carrier.

2. An electronic chip-carrier mounting and heat sink as set forth in claim 1 wherein said recess in said socket is shallow and of substantially rectangular-parallelepiped form adapted to receive therein a carrier which is also of substantially said form, wherein said heat-transfer surface of said central heat-sink portion is correspondingly rectangular, and wherein said heat-radiating members extend upwardly from along all four edges of said central heat-sink portion.

3. An electronic chip-carrier mounting and heat sink as set forth in claim 2 wherein said heat-radiating members are bent to incline over the top of said central heat-sink portion in spaced relation thereto.

4. An electronic chip-carrier mounting and heat sink as set forth in claim 3 wherein said heat-radiating members are plates each of which at its lower end is about the width of the edge of said heat-sink portion from along which it is bent.

5. An electronic chip-carrier mounting and heat sink as set forth in claim 4 wherein each of said plates is perforated to promote circulation of ambient atmosphere through spaces between it and said top of said heat-sink portion.

6. An electronic chip-carrier mounting and heat sink as set forth in claim 2 wherein said fastener means comprises clip members which are flexible and which snap onto and catch releasably with said fastener provisions on said socket, said clip members being disposed near corners of said central heat-sink portion and being of said sheet metal and integral with said single-piece composite heat-sink and cover means.