Means and method for stabilizing polycrystalline semiconductor layers

• US 4,682,407 A
• Filed: 01/21/1986
• Issued: 07/28/1987
• Est. Priority Date: 01/21/1986
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Wilson, Syd R., Varker, Charles J., Gregory, Richard B.
• Primary Examiner(s): Roy, Upendra
• Application Number:
  US06/821,095
• Time in Patent Office: 553 Days
• Field of Search: 148/1.5, 148/187, 148/175, 29/576 B, 29/571
• US Class Current: 438/517
• CPC Class Codes: H01L 21/28176 with a treatment, e.g. annealing, after the formation of the definitive gate conductor
• CPC Class Codes: H01L 21/32155 Doping polycristalline - or amorphous silicon layers
• CPC Class Codes: H01L 29/04 characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes characterised by physical imperfections H01L29/30
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 148/024 Defect control-gettering and annealing
• CPC Class Codes: Y10S 148/061 Gettering-armorphous layers
• CPC Class Codes: Y10S 148/153 Solar cells-implantations-laser beam
• CPC Class Codes: Y10S 438/92 Controlling diffusion profile by oxidation

Abstract

Implantation of oxygen or nitrogen in polysilicon layers to a dose above about 10¹⁵ ions/cm² retards rapid grain boundary migration of conventional dopants such as B, P, As, Sb, and the like during dopant activation. Pre-annealing of the poly films to increase the grain size also decreases rapid grain boundary migration. The efffects can be combined by first pre-annealing and then implanting oxygen or nitrogen before introducing the dopant. It is desirable to anneal the oxygen implant before introducing the dopant to allow for oxygen diffusion to the grain surfaces where is precipitates and blocks the grain boundaries. Vertical and lateral migration of the dopants can be inhibited by placing the implanted oxygen or nitrogen between the dopant and the location desired to be kept comparatively free of dopants. When very high dopant activation temperatures are used the blocking effect of the oxygen on the grain boundaries is overwhelmed by dopant diffusion through the grains.

Claims

1. A method for controlling dopant migration in polycrystalline semiconductor layers, comprising:

providing a substrate;

forming a polycrystalline semiconductor layer of a first thickness on said substrate, wherein said polycrystalline semiconductor layer has grains therein separated by grain boundaries;

implanting oxygen or nitrogen or mixtures thereof into a first zone of said polycrystalline semiconductor layer to a dose in the range from more than 10¹⁴ to less than 10¹⁷ ions/cm², wherein said first zone has a second thickness less than said first thickness and a peak implant concentration located at a predetermined distance below the outward surface of said polycrystalline semiconductor layer and a implant concentration at said outward surface less than said peak concentration;

heating said polycrystalline semiconductor layer to migrate said oxygen or nitrogen or mixtures thereof to said grain boundaries;

thereafter implanting a conductivity enhancing dopant into a second zone of said polycrystalline semiconductor layer; and

heating said polycrystalline semiconductor layer to activate said dopant so that it is electrically active.

2. The method of claim 1 further comprising before said first implanting step the step of heating said polycrystalline semiconductor layer to increase the grain size.

3. The method of claim 1 wherein said semiconductor layer is formed of silicon.

4. The method of claim 1 wherein said first implanting step comprises implanting so that said first zone is separated from said first surface by a third zone having an implanted oxygen or nitrogen level small enough so as not to substantially affect dopant migration therein.

5. The method of claim 1 wherein said first implanting step comprises implanting with oxygen to a dose in the range from more than 10¹⁵ to about 10¹⁶ ions/cm².

6. The method of claim 1 wherein said second implanting step is deeper than said first implanting step.

7. The method of claim 1 wherein said second implanting step is shallower than said first implanting step.

8. The method of claim 2 wherein said semiconductor layer comprises silicon.

9. The method of claim 2 wherein said second implanting step is deeper than said first implanting step.

10. The method of claim 2 wherein said second implanting step is shallower than said first implanting step.

11. The method of claim 3 wherein said second implanting step comprises implanting As, B, P, Sb, Al, Ga, or In.

12. The method of claim 3 wherein said first heating step comprises heating to temperatures in the range 500-1000 degrees C. for less than about 40 minutes.

13. The method of claim 3 wherein said first heating step comprises heating to temperatures in the range 1000-1300 degrees C. for a time less than 60 seconds.

14. The method of claim 3 wherein said first heating step comprises heating first to temperatures in the range 500-1000 degrees C., for a time less than 40 minutes and thereafter heating to temperatures in the range 1000-1300 degrees C. for less than 60 seconds.

15. The method of claim 3 wherein said second heating step comprises heating to a maximum temperature in the range 1000-1300 degrees C. for times in the range 1-20 seconds.

16. The method of claim 8 wherein first heating step comprises heating to temperatures in the range 1000 to 1300 for times less than 90 seconds.

17. The method of claim 8 wherein said second heating step comprises heating to temperatures in the range 500-1000 degrees C. for less than about 40 minutes.

18. The method of claim 8 wherein said second heating step comprises heating to temperatures in the range 1000-1300 degrees C. for a time less than 60 seconds.

19. The method of claim 8 wherein said second heating step comprises heating first to temperatures in the range 500-1000 degrees C., for a time less than 40 minutes and thereafter heating to temperatures in the range 1000-1300 degrees C. for less than 60 seconds.

20. The method of claim 8 wherein said step of heating prior to said first implanting step comprises heating to a maximum temperature in the range 1000-1300 degrees C. for times in the range 1-20 seconds.

21. The method of claim 12 wherein said second heating step comprises heating to a maximum temperature in the range 1000-1300 degrees C. for times in the range 1-20 seconds.

22. The method of claim 13 wherein said second heating step comprises heating to a maximum temperature in the range 1000-1300 degrees C. for times in the range 1-20 seconds.

23. The method of claim 14 wherein said second heating step comprises heating to a maximum temperature in the range 1000-1300 degrees C. for times in the range 1-20 seconds.

24. The method of claim 16 wherein said first implanting step comprises implanting with oxygen to a dose in the range from more than 10¹⁴ to less than 10¹⁷ ions/cm².

25. The method of claim 16 wherein said first implanting step comprises implanting with oxygen to a dose in the range from 10¹⁵ to about 10¹⁶ ions/cm².