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Multi-layer circuit board bonding method utilizing noble metal coated surfaces

  • US 4,685,210 A
  • Filed: 03/13/1985
  • Issued: 08/11/1987
  • Est. Priority Date: 03/13/1985
  • Status: Expired due to Fees
First Claim
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1. A method of forming an electrically and mechanically sound joint between internal layers of a multi-layer plated through hole printed circuit board comprising the steps of:

  • applying a coating of a noble metal to layer surfaces to be conductively joined on the through hole board layers;

    juxtaposing the noble metal coated surfaces on the through hole board layers;

    applying a layer of thermal adhesive over the outer surfaces of the juxtaposed through hole board layers;

    juxtaposing imperforate outer board layers over the adhesive layers; and

    exposing the juxtaposed layers to a pressure from about 100 psi to about 10,000 psi and a temperature from about 400 to about 1000 degrees F. until the noble metal coated surfaces bond to form an electrically and mechanically sound metal to metal joint and thermal adhesive is extruded into the through holes of the internal through hole board layers, thereby forming a multi-layer board with buried through hole interconnections.

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