Adhesively mountable die attach film

• US 4,687,693 A
• Filed: 06/13/1985
• Issued: 08/18/1987
• Est. Priority Date: 06/13/1985
• Status: Expired due to Fees

• Current Assignee: National Starch And Chemical Corporation (Ingredion Incorporated)
• Original Assignee: Stauffer Chemical Company (Nouryon BV)
• Inventors: Aurichio, Joseph A., Sheyon, Gregory M.
• Primary Examiner(s): Kittle, John E.
• Assistant Examiner(s): Ryan, Patrick J.
• Application Number:
  US06/744,352
• Time in Patent Office: 796 Days
• Field of Search: 428/148, 428/195, 428/210, 156/238, 117/3.1, 117/6, 117/212, 117/227, 161/208, 154/140, 174/212
• US Class Current: 428/148
• CPC Class Codes: H01L 21/302 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: Y10T 428/24413 Metal or metal compound
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

The present invention is a die attach film which is adapted for adhesive mounting to a dicing frame. The film contains a support film, a curable die bonding adhesive releasably mounted on the support film which is adapted to receive semiconductor wafer, semiconductor die, and the like, and adhesive means to bond the support film to a dicing frame. In one embodiment the adhesive means comprise pressure sensitive adhesive means on the support film itself adjacent the portions designed to contact the dicing frame. In another embodiment, the adhesive means comprise a larger tacky film bonded to the bottom of the support film for the die attach film.

Claims

1. A die attach film adapted for adhesive mounting to a dicing frame, when the frame is brought into contact with the film, which comprises:

(a) a support film;

(b) a curable die bonding adhesive releasably mounted on the support film; and

(c) adhesive means to bond the support film to a dicing frame, said adhesive means comprising a larger tacky film to which the support film carrying the adhesive (b) is bonded.

2. A film as claimed in claim 1 wherein the die bonding adhesive is adapted to support a semiconductor wafer for dicing, when the wafer is brought into contact with the adhesive.

3. A film as claimed in claim 1 wherein the die bonding adhesive is adapted to support a semiconductor die after it has been diced, when the die is brought into contact with the adhesive.

4. A film as claimed in claim 1 wherein the die bonding adhesive is electrically conductive.

5. A film as claimed in claim 2 wherein the die bonding adhesive comprises an electrically conductive adhesive.

6. A film as claimed in claim 1 wherein the portion of the tacky film under the die bonding adhesive adapted to support the wafer, when the wafer is brought into contact with the adhesive, has been removed.

7. In combination, a dicing frame and the film of claim 1.

8. In combination, a dicing frame and the film of claim 2.

9. In combination, a dicing frame and the film of claim 4.

10. In combination, a dicing frame and the film of claim 5.

11. In combination, a dicing frame and the film of claim 6.

12. A film as claimed in claim 1 which further comprises a release covering to protect the adhesive (b).