Semiconductor wafer dicing machine
First Claim
1. A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern, said dicing machine comprisinga cutting station,two alignment stations,cutting means disposed in the cutting station and arranged between said two alignment stations,detecting means disposed in the alignment station for detecting the cutting lines of the wafer, andwafer transferring means including two wafer supporting means mounted rotatably, a main moving means for moving the wafer supporting means, and two rotating means respectively annexed to the two wafer supporting means for rotating the two wafer supporting means respectively,one of the two wafer supporting means being movable between one of the two alignment stations and the cutting station while the other of the wafer supporting means is movable between the other of the alignment stations and the cutting station, andsaid dicing machine being capable of positioning one of the two wafer supporting means in the alignment station, detecting the cutting lines of a semiconductor wafer supported with said one of the wafer supporting means by detecting means and performing alignment including rotating said one of the wafer supporting means on the basis of this detection while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means.
1 Assignment
0 Petitions
Accused Products
Abstract
A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means disposed in the alignment station for detecting the cutting lines of the wafer, and a wafer transferring means. The wafer transferring means includes two wafer supporting means and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades and a cutting blade interval setting-up means for setting up the interval of these cutting blades.
93 Citations
15 Claims
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1. A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern, said dicing machine comprising
a cutting station, two alignment stations, cutting means disposed in the cutting station and arranged between said two alignment stations, detecting means disposed in the alignment station for detecting the cutting lines of the wafer, and wafer transferring means including two wafer supporting means mounted rotatably, a main moving means for moving the wafer supporting means, and two rotating means respectively annexed to the two wafer supporting means for rotating the two wafer supporting means respectively, one of the two wafer supporting means being movable between one of the two alignment stations and the cutting station while the other of the wafer supporting means is movable between the other of the alignment stations and the cutting station, and said dicing machine being capable of positioning one of the two wafer supporting means in the alignment station, detecting the cutting lines of a semiconductor wafer supported with said one of the wafer supporting means by detecting means and performing alignment including rotating said one of the wafer supporting means on the basis of this detection while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means.
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12. A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern,
said dicing machine comprising a cutting means and a wafer supporting means, and said cutting means and wafer supporting means being adapted to be linearly moved relative to each other in a predetermined direction whereby the wafer supported with the wafer supporting means is cut by the cutting means, the wafer supporting means being mounted movably in the x-axis direction, a moving means for moving the wafer supporting means in the x-axis direction, and the wafer supporting means being adapted to be moved in the x-axis direction by the moving means when the wafer supported with the wafer supporting means is cut by the cutting means, said cutting means including two rotating shafts extending in the y-axis direction perpendicular to the x-axis direction where the relative linear moving direction of the cutting means and wafer supporting means is the x-axis direction, two cutting blades fixed to the two rotating shafts respectively and a blade rotating means for rotating the two rotating shafts, the two rotating shafts of the cutting means being mounted for linear movement in the y-axis direction and for movement in the z-axis direction perpendicular to both the x-axis direction and the y-axis direction, the cutting means further including a y-axis direction moving means for linearly moving the rotating shafts in the y-axis direction and a z-axis direction moving means for moving the rotating shafts in the z-axis direction, one of said two rotating shafts being mounted linearly movable relative to the other in the y-axis direction, the cutting means further including a main support frame mounted linearly movably in the y-axis direction, a first subsidiary support frame mounted on the main support frame and a second support frame mounted on the main support frame for linear movement in the y-axis direction; - said the other of the two rotating shafts is rotatably mounted on the first subsidiary support frame;
said one of the rotating shafts is rotatably mounted on the second subsidiary support frame;
the y-axis direction moving means is drivingly connected to the main support frame to linearly move the main support frame in the y-axis direction to thus linearly move both of the two rotating shafts in the y-axis direction; and
the cutting blade interval setting-up means is drivingly connected to the second subsidiary support frame in the y-axis direction to thus linearly move said one of the two rotating shafts in the y-axis direction,said cutting means further including a cutting blade interval setting-up means for linearly moving said one of the two rotating shafts relative to said the other in the y-axis direction. - View Dependent Claims (13, 14, 15)
- said the other of the two rotating shafts is rotatably mounted on the first subsidiary support frame;
Specification